Shadow Mask Cleaning in Electronic Device Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in volume manufacturing of electronic circuits is the degradation of shadow masks due to accumulated material, which degrades their performance and requires frequent replacement or labor-intensive cleaning, making it inefficient and costly.
Innovation Solution
A method and apparatus that integrate shadow mask cleaning into the manufacturing process by using a system with multiple vacuum deposition vessels and cleaning vessels, allowing for concurrent deposition and cleaning of shadow masks, enabling rapid and cost-effective mask cleaning and replacement within the production line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If shadow masks are used repeatedly for patterning material onto substrates, then manufacturing productivity is improved, but the shadow masks accumulate material on their surface and in their apertures, degrading mask performance
Solution Approach 1:
The patent implements a preliminary cleaning action by positioning a cleaning vessel with a fresh shadow mask in readiness before the deposition process begins. The cleaning vessel is prepared in advance to receive and clean the used mask, ensuring that cleaning is performed before the mask degradation severely impacts productivity, thus maintaining both high productivity and mask performance.
Solution Approach 2:
The patent introduces a cleaning vessel as an intermediary component between the deposition vessel and the mask replacement process. This cleaning vessel acts as a mediator that receives the used shadow mask from the deposition vessel, cleans it, and prepares it for reuse or replacement, thereby resolving the contradiction between continuous production and mask maintenance.
2Reliability
If shadow masks are frequently replaced to maintain performance, then mask performance is maintained, but manufacturing complexity and costs increase
Solution Approach 1:
The patent merges the cleaning function with the deposition process by integrating a cleaning vessel into the deposition system. The cleaning vessel is positioned adjacent to the deposition vessel and operates concurrently with the deposition process, combining two previously separate operations (deposition and cleaning) into a unified system that reduces overall manufacturing complexity.
Solution Approach 2:
The cleaning vessel serves multiple functions: it holds a clean shadow mask ready for use, receives and cleans used masks from the deposition vessel, and can independently operate during the deposition process. This multi-functionality reduces the need for separate dedicated cleaning equipment, thereby reducing manufacturing complexity while maintaining mask performance.
3Reliability
If shadow masks are cleaned frequently to remove deposited material, then mask performance is maintained, but production speed is reduced due to time required for cleaning
Solution Approach 1:
The patent ensures continuity of useful action by having the cleaning vessel operate concurrently with the deposition vessel. While one shadow mask is being used for deposition, another mask is being cleaned in the cleaning vessel, ensuring that cleaning operations do not interrupt the deposition process. This continuous parallel operation maintains both mask performance and production speed.
Solution Approach 2:
The cleaning vessel prepares clean shadow masks in advance before they are needed in the deposition vessel. By performing cleaning operations beforehand and having clean masks ready, the system avoids interruptions in the deposition process, thereby maintaining production speed while ensuring mask performance through frequent cleaning.
4Reliability
If labor-intensive cleaning methods are used to clean shadow masks, then mask performance is maintained, but manufacturing costs and time increase
Solution Approach 1:
The cleaning vessel is designed to automatically clean shadow masks without requiring manual intervention. The system uses automated cleaning mechanisms that can remove deposited material from masks through chemical or physical processes, eliminating the need for labor-intensive manual cleaning operations. This self-service capability reduces both cleaning time and labor costs while maintaining mask performance.
Solution Approach 2:
The patent replaces manual labor-based cleaning methods with automated mechanical or chemical cleaning systems. The cleaning vessel employs automated mechanisms such as chemical etching, plasma cleaning, or mechanical scraping to remove deposited material from masks, substituting human labor with automated systems that are faster and more consistent, thereby reducing cleaning time and costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and cost-effective shadow mask cleaning and replacement, maintaining mask performance over multiple deposition cycles without disrupting the production line, thereby optimizing manufacturing speed and reducing the need for extensive clean room environments.
Implementation Method 1
The vapor deposition shadow mask process is a significantly less costly and less complex manufacturing process
Implementation Method 2
Some degraded shadow masks may be cleaned to remove deposited material from the mask
Data Source
AI summary
Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least two shadow masks associated therewith. Each of the two masks is alternately positioned within the corresponding deposition vessel for patterning the deposition material onto the substrate through apertures in the mask positioned therein, and positioned in an adjacent cleaning vessel for mask cleaning. The patterning onto the substrate and the cleaning of at least one of the masks are performed concurrently.