Shadowed Grid Structures for Vacuum Electronics Electrodes

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Solution Overview

Problem

Conventional integrated grid structures in vacuum electronics devices face limitations due to insulator susceptibility to dielectric breakdown, leading to voltage limitations, leakage current, and issues like electrical shorting, contamination, and corrosion, as the insulator is in direct contact with the grid and electrodes.

Innovation Solution

The development of shadowed grid structures where grid supports are positioned out of the line of sight from particles, reducing the likelihood of impact and associated issues, achieved through a fabrication process that creates wider grid lines supported by narrower grid supports, allowing for increased voltage application and reduced leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If an insulator layer is used to support the conductive grid, then mechanical support is provided, but dielectric breakdown occurs limiting maximum voltage

Engineering Contradiction:
Improvemechanical supportVSAvoidvoltage handling capacity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent removes the insulator layer from the line of sight between the grid and electrode, extracting the harmful exposure of the insulator to particle impact. The grid supports are positioned laterally offset from the direct path, eliminating their exposure to charged particles while maintaining mechanical support function.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces grid supports as intermediary structures that provide mechanical support without being in direct contact with the grid in the traditional sense. These supports are positioned laterally offset and connect the grid to the electrode structure without being in the line of sight, acting as mediators that provide support while avoiding particle exposure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If the insulator is in direct contact with the grid and electrodes, then mechanical support is provided, but leakage current flows through the insulator

Engineering Contradiction:
Improvemechanical supportVSAvoidleakage current
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the insulator from the direct support role by positioning grid supports laterally offset from the grid. This removes the insulator from the line of sight and eliminates the pathway for leakage current through the insulator bulk, while the grid supports maintain mechanical support function.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If particles impact the insulator layer, then electrical shorting and contamination occur, but the insulator cannot be removed as it provides structural support

Engineering Contradiction:
Improveelectrical isolationVSAvoidstructural support structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the insulator from the particle impact path by lateral offset positioning of grid supports. This eliminates electrical shorting and contamination issues while maintaining structural support through the offset support architecture.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from a vertical support structure (insulator directly beneath grid) to a lateral offset support structure. By moving the support function to the lateral dimension rather than the vertical dimension, the insulator is removed from the line of sight while support is maintained through side-mounted grid supports.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10658144B2Shadowed grid structures for electrodes in vacuum electronics
Publication Date: 2020.05.19 MODERN HYDROGEN INC
  • US10658144B2 patent drawing
  • US10658144B2 patent drawing
  • US10658144B2 patent drawing

AI summary

Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.