Shallow Electric Component With Carrier Cutout
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Solution Overview
Problem
Existing electric components, particularly MEMS components, often have excessively large structural heights due to the combination of chip and carrier heights, leading to mechanical instability and increased manufacturing costs from thinning processes.
Innovation Solution
An electric component design featuring a carrier with a cutout that penetrates through it, allowing the chip to be arranged within, thereby reducing the total height and enhancing mechanical stability, while a thicker carrier compensates for structural weakening, eliminating the need for extensive thinning processes and allowing for efficient manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thin wafers with larger radius are used to arrange more components per wafer, then the quantity of components increases, but the mechanical stability deteriorates due to warpage, unevennesses and fracture
Solution Approach 1:
The chip is arranged in a cutout that penetrates through the carrier, nesting the chip within the carrier structure. This allows the chip height to determine the total component height rather than the carrier thickness, enabling the use of thicker carriers for mechanical stability while maintaining shallow overall profile
Solution Approach 2:
The cutout penetrates through the carrier in the vertical dimension, creating a through-hole structure that accommodates the chip. This dimensional approach allows the chip to be positioned within the carrier thickness rather than adding to it, resolving the conflict between component quantity and mechanical stability
2Reliability
If the carrier is made thicker to compensate for structural weakening from cutout, then the mechanical stability improves, but the manufacturing complexity increases due to thinning processes
Solution Approach 1:
Instead of making the carrier thin and adding thinning processes, the invention inverts the approach by using a thicker carrier from the start. The cutout penetrates through this thicker carrier, eliminating the need for subsequent thinning operations and reducing manufacturing complexity
Solution Approach 2:
The cutout is created in the carrier before final assembly, preliminarily preparing the structure to accommodate the chip. This preliminary action with a thicker carrier avoids the need for later thinning processes, simplifying manufacturing
3Reliability
If the chip is mounted on a carrier with significant thickness, then the mechanical stability improves, but the total height increases excessively
Solution Approach 1:
The chip is nested within the carrier's cutout, allowing the chip height to be the determining factor for total component height rather than the carrier thickness. This nesting arrangement enables the use of thicker carriers for stability while maintaining shallow overall profile
Solution Approach 2:
The cutout penetrates through the carrier vertically, changing the dimensional relationship between carrier and chip. The chip fits within the carrier thickness dimension rather than adding to it, allowing thick carriers without increasing total height
Data Source
AI summary
Electric components and methods of manufacture are specified. An electric component comprises a carrier having a recess which penetrates the carrier and also a first chip and external contact area. The first chip is arranged in the recess in the carrier. The external contact area is provided for connecting up the first chip to an external circuit environment.