Shape Memory Polymer Thermal Interface Material for Chip Heat Dissipation

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Solution Overview

Problem

Conventional thermal interface materials face challenges in efficiently dissipating heat from computing chips due to surface variances and the need for high compression forces, which can damage chips, and existing solutions do not effectively address the issue of inconsistent bond lines and air gaps.

Innovation Solution

The use of shape memory polymer (SMP) thermal interface material pads, specifically liquid crystal elastomer (LCE) matrices with thermally conductive fillers, which can be deformed and reformed to conform to chip surfaces, fill gaps, and align fillers for optimal heat transfer, using external stimuli like temperature and pressure to adjust thickness and alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional thermal interface materials are used to dissipate heat from computing chips, then heat transfer function is provided, but high compression forces are required which can damage chips

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidchip damage from compression force

Core Design Contradiction:

Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The patent changes the physical state parameter of the thermal interface material by using shape memory polymer that transitions between deformed and reformed states. The material is deformed to reduce thickness and applied to the chip, then heated to trigger reformation that increases thickness and reduces compression force on the chip, while maintaining thermal contact through phase transition

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The shape memory polymer utilizes thermally-induced phase transition between deformed and reformed states. When heated above the transition temperature, the polymer chains reorganize causing the material to revert from the deformed thin state to the reformed thicker state, automatically reducing compression force on the chip while maintaining thermal interface

Inventive Principle:

Principle #36Phase transitions

2Loss of energy

If conventional thermal interface materials are used, then heat transfer is provided, but surface variances cause inconsistent bond lines and air gaps

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidbond line consistency

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The thermal interface material is applied in a deformed dynamic state with reduced thickness, allowing it to conform to surface irregularities. The material's shape can change in response to thermal stimulation, enabling it to adapt to surface variances and eliminate air gaps through the reformation process

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

By changing the thickness parameter through shape memory effect, the material can be applied thin to conform to surfaces, then thickened through heating to fill gaps and ensure consistent contact across the interface, resolving bond line inconsistency

Inventive Principle:

Principle #35Parameter changes

3Loss of energy

If shape memory polymer TIM pads are deformed to reduce thickness, then heat dissipation is improved, but the material must be heated to reformation temperature which adds process complexity

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheating process requirement

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The shape memory polymer can be heated using the heat from the computing chip itself or ambient operating conditions. The material utilizes the thermal environment it is deployed in to trigger its own reformation, eliminating the need for separate external heating equipment or complex processing systems

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The SMP TIM pads improve heat dissipation by reducing bond line thickness, increasing thermal conductivity, and ensuring consistent contact without damaging the chip, even with high-performance computing components, by adapting to surface irregularities and applying controlled forces.

Implementation Method 1

The deformed SMP TIM pad may be heated to a reformation temperature

Methodology Applied

Scientific EffectShape memory polymer phase transition: Shape Memory Polymer

Implementation Method 2

A SMP matrix and a thermally conductive filler may be mixed to create a SMP mixture

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9937662B2Shape memory thermal interface materials

Publication Date: 2018.04.10 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.