Shared Power Line Connection Structure for Semiconductor Integration
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Solution Overview
Problem
The increasing demand for high integration and reliability in semiconductor devices poses challenges in manufacturing complex and highly integrated field effect transistors, particularly in efficiently connecting power lines to source/drain regions across different logic cells while maintaining manufacturing simplicity.
Innovation Solution
A semiconductor device design featuring a connection structure with a bridge portion connecting contact portions across logic cells, allowing power lines to be electrically connected to source/drain regions of adjacent logic cells, which simplifies the manufacturing process and enhances integration by using metallic materials like aluminum, copper, tungsten, molybdenum, and cobalt.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power lines are connected to source/drain regions across different logic cells using conventional separate connection structures, then manufacturing complexity increases, but integration efficiency and reliability are reduced
Solution Approach 1:
The patent merges separate connection structures into a single shared connection structure that electrically connects power lines to source/drain regions of multiple adjacent logic cells simultaneously. This unified structure reduces the number of discrete components and interconnections needed, thereby lowering manufacturing complexity while improving integration reliability through standardized fabrication processes
2Productivity
If conventional separate connection structures are used for each logic cell, then manufacturing precision can be maintained, but manufacturing efficiency and integration density are reduced
Solution Approach 1:
The shared connection structure is designed to serve multiple logic cells simultaneously, performing the same electrical connection function across different cells. This multi-functional approach allows a single structure to replace multiple separate structures, improving manufacturing efficiency by reducing the number of fabrication steps while maintaining the simplicity of standardized connection design
3Reliability
If more connection structures are added to connect power lines across logic cells, then electrical connectivity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Multiple separate connection structures are merged into a single shared connection structure that provides electrical connectivity to multiple logic cells. This consolidation maintains reliable electrical connections while simplifying the manufacturing process by reducing the number of discrete structures that need to be fabricated and aligned
Data Source
AI summary
Disclosed are a semiconductor device and a method of manufacturing the same. The semiconductor device includes first and second logic cells adjacent to each other in a first direction on a substrate, a gate electrode extending in the first direction in each of the first and second logic cells, a power line extending in a second direction at a boundary between the first and second logic cells, and a connection structure electrically connecting the power line to an active pattern of the first logic cell and to an active pattern of the second logic cell. The connection structure lies below the power line and extends from the first logic cell to the second logic cell. A top surface of the connection structure is at a higher level than that of a top surface of the gate electrode.