Shared Read-Port Multi-Bitcell Layout for Higher SRAM Density

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Solution Overview

Problem

Conventional transistor-based devices using traditional layout techniques suffer from low density design applications, leading to inefficiencies and density deficiencies in fabrication processes, making it challenging to implement various layout configurations effectively.

Innovation Solution

The development of multi-transistor dual-port bitcell architecture with shared multi-transistor read port designs, utilizing complimentary field-effect transistor (FET) technologies, allows for the fabrication of multiple device stacks in a single monolithic semiconductor die or sequentially, enabling flexible device configurations such as N-over-N, P-over-P, N-over-P, and P-over-N stack configurations with common-gate and split-gate architectures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If traditional layout techniques are used, then manufacturing simplicity is maintained, but device density is low

Engineering Contradiction:
Improvedevice densityVSAvoidlayout configuration complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent implements multi-transistor stacks arranged in vertical dimensions rather than traditional planar layouts. Multiple transistors are stacked vertically to form compact three-dimensional structures, enabling significantly higher device density within the same footprint while maintaining manufacturability through standardized stack configurations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent develops universal multi-transistor stack configurations (such as 6T, 8T, 10T stacks) that can serve multiple functions including memory bitcells, logic circuits, and register files. These standardized stack designs provide layout flexibility and adaptability across different application domains while simplifying the fabrication process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Quantity of substance

If multi-transistor stacks are implemented, then device density is improved, but fabrication complexity increases

Engineering Contradiction:
Improvedevice densityVSAvoidfabrication process simplicity
Core Design Contradiction:
Quantity of substanceVSEase of manufacture

Solution Approach 1:

The patent employs complementary FET technologies with controlled threshold voltage parameters to enable precise control over transistor behavior in stacked configurations. By carefully managing electrical parameters such as threshold voltage matching and gate control characteristics, the patent achieves reliable multi-transistor stack operation while maintaining compatibility with existing fabrication processes.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If shared read port architecture is used, then device functionality is enhanced, but circuit complexity increases

Engineering Contradiction:
Improvedevice functionalityVSAvoidcircuit architecture complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements shared read port architectures where multiple multi-transistor stacks share common read access circuits and control logic. This merging of resources enables enhanced functionality and improved resource utilization while reducing the overall circuit complexity compared to providing dedicated read ports for each stack.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12165737B2Multi-bitcell structure with shared read port
Publication Date: 2024.12.10 ARM LTD
  • US12165737B2 patent drawing
  • US12165737B2 patent drawing
  • US12165737B2 patent drawing

AI summary

Various implementations described herein are directed to a device having a multi-bitcell structure with multiple bitcells. The multiple bitcells may include first port transistors and second port transistors. The first port transistors may be arranged in a P-over-N stack configuration, and the second port transistors may be arranged in an N-over-N stack configuration.