Memory Cell Array Circuit With Shared Source Lines for Lower Resistance

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Solution Overview

Problem

As semiconductor integrated circuits (ICs) become smaller and more complex, the resistance of conductive lines within digital devices affects operating voltages and overall IC performance, particularly in memory macros, necessitating a solution to manage resistance variations.

Innovation Solution

A memory cell array design with shared source lines between adjacent columns of memory cells, reducing the number of source lines and corresponding routing tracks, thereby minimizing source line resistance and equalizing it with bit line resistance, which simplifies peripheral circuitry and increases memory density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of source lines is reduced by sharing between adjacent columns, then source line resistance is minimized and memory density is increased, but the complexity of routing and layout design increases

Engineering Contradiction:
Improvesource line resistanceVSAvoidrouting and layout design complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Adjacent columns of memory cells share common source lines, combining multiple source line functions into fewer shared lines. This merging reduces the total number of source lines required, thereby minimizing source line resistance and allowing for denser memory cell arrays while managing the complexity through systematic sharing patterns.

Inventive Principle:
Principle #5Merging (Combining)

2Quantity of substance

If source line resistance is minimized through shared source lines, then memory density increases, but peripheral circuitry becomes more complex

Engineering Contradiction:
Improvememory densityVSAvoidperipheral circuitry complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The shared source lines are designed to serve multiple columns of memory cells simultaneously, making them universal conductive paths. This multi-functionality allows the same source line infrastructure to support more memory cells, increasing memory density while the systematic design of shared lines helps manage peripheral circuitry complexity through standardized interfaces.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Stability of the object's composition

If conductive lines are optimized for resistance, then operating voltage stability improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improveoperating voltage stabilityVSAvoidconductive line resistance control
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The design changes the topological parameters of the conductive line network by introducing shared source lines between adjacent columns. This parameter change fundamentally alters the resistance characteristics, allowing for better voltage stability across the memory array. The systematic sharing pattern provides predictable resistance characteristics that can be manufactured with standard precision tolerances.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250291992A1Memory cell array circuit and method of forming the same
Publication Date: 2025.09.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250291992A1 patent drawing
  • US20250291992A1 patent drawing
  • US20250291992A1 patent drawing

AI summary

A memory cell array includes a first and a second column of memory cells, a first and a second bit line, a source line and a first set of vias. The second bit line includes a first conductive line located on a first metal layer, and a second conductive line located on a second metal layer. The first and second conductive lines overlap a first source of a first selection transistor of a first memory cell of the second column of memory cells. The source line is coupled to the first and second column of memory cells. The first set of vias is electrically coupled to the first and second conductive line. A pair of vias of the first set of vias is located above where the first conductive line overlaps each memory cell of the second column of memory cells.