Shield-Can Film Structure for Dent-Free EMI Shield Assembly

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Solution Overview

Problem

Existing electronic apparatuses face challenges in manufacturing compact, high-performance devices due to the need to manage electromagnetic waves generated by components on printed circuit boards, which can interfere with communication functions.

Innovation Solution

The electronic apparatus includes a circuit board, a driving chip, a shield-can with a top surface covering the driving chip, and a first film with a first opening that exposes part of the shield-can's top surface, along with a second film that is attached and later removed to form identification marks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a shield-can is used to block electromagnetic waves, then communication function is protected, but the shield-can may be damaged during assembly processes

Engineering Contradiction:

Improvecommunication functionVSAvoidshield-can integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

A protective film is attached to the shield-can before assembly processes begin, providing preemptive protection against dents and damage during subsequent manufacturing steps

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The protective film acts as an intermediary layer between the shield-can and external forces during assembly, absorbing impact and preventing direct damage to the shield-can structure

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of information

If identification marks are formed on the shield-can, then component identification is enabled, but the manufacturing process becomes more complex

Engineering Contradiction:

Improvecomponent identificationVSAvoidmanufacturing process

Core Design Contradiction:

Loss of informationVSDevice complexity

Solution Approach 1:

A second film with pre-formed identification marks is attached to the shield-can before final assembly, allowing identification information to be transferred without requiring post-assembly marking operations

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Identification marks are copied from the second film to the shield-can through direct contact and subsequent removal of the second film, eliminating the need for complex direct marking processes on the shield-can

Inventive Principle:

Principle #26Copying

3Volume of moving object

If the electronic apparatus is made compact, then device size is reduced, but electromagnetic wave management becomes more difficult

Engineering Contradiction:

Improvedevice sizeVSAvoidelectromagnetic wave interference

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

Thin protective films are applied to the shield-can surface, providing electromagnetic shielding and protection without adding significant volume, thus maintaining compact device size while managing electromagnetic waves

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS12283550B2Electronic apparatus and method of manufacturing the same

Publication Date: 2025.04.22 SAMSUNG DISPLAY CO LTD

AI summary

An electronic apparatus includes: a circuit board; a driving chip mounted on the circuit board; a shield-can including a top surface and a side surface extending in a direction from the top surface to the circuit board, wherein the top surface covers the driving chip; and a first film disposed on the shield-can and including a first opening that exposes a part of the top surface of the shield-can.