Conductive Shield Circuit Assembly EMI Integration
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Solution Overview
Problem
Electronic devices face inefficiencies and signal degradation due to electromagnetic interference (EMI)/radio frequency interference (RFI) from unshielded components, which existing solutions fail to adequately address, especially in densely packed consumer electronics where space is a concern.
Innovation Solution
Implementing a multifunctional electrically conductive structure, such as a board level shield or mid-plate, that provides EMI shielding and supports a multilayer circuit assembly, with an electrically nonconductive material coating for electrical isolation and thermal conductivity, allowing for efficient space utilization and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional separate shielding and circuit support structures are used, then EMI shielding function is provided, but device space is wasted and structure complexity increases
Solution Approach 1:
The patent combines the EMI shielding function and circuit support function into a single integrated structure. The conductive shield structure serves dual purposes: providing electromagnetic interference shielding while simultaneously supporting electrical components and circuits directly on its surface, eliminating the need for separate support structures and reducing overall device complexity.
Solution Approach 2:
The shield structure is designed to perform multiple functions simultaneously: EMI shielding, mechanical support for components, electrical connection pathways, and thermal management. This multi-functional design reduces the number of separate components needed and simplifies the overall device architecture.
2Object-affected harmful factors
If traditional separate shielding and circuit support structures are used, then EMI shielding function is provided, but device space utilization is reduced
Solution Approach 1:
By merging the shielding structure and circuit support into one integrated component, the patent eliminates the space that would be required for separate support structures. Electrical components and circuits are mounted directly on the shield surface, maximizing space utilization within the device envelope.
3Object-affected harmful factors
If electrically conductive material is used for shielding, then EMI shielding is effective, but electrical isolation for circuit components is compromised
Solution Approach 1:
The conductive coating is applied selectively to specific regions of the shield structure where EMI shielding is needed, while leaving other regions electrically isolated or insulated. This localized application allows the shield to provide electromagnetic protection in critical areas while maintaining electrical isolation requirements for adjacent circuit components.
Solution Approach 2:
The patent uses intermediate insulating structures or coatings between the conductive shield portions and adjacent circuit components. These intermediaries allow the shield to maintain its EMI shielding effectiveness while preventing unwanted electrical coupling between the conductive shield and sensitive circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively shields against EMI/RFI, supports electrical components, and provides a thermally conductive path, enhancing device performance and space efficiency by integrating shielding and circuit support in a single structure.
Implementation Method 1
An electrically nonconductive material is on at least part of the electrically conductive structure
Implementation Method 2
provides a thermally conductive path
Data Source
AI summary
In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.