Shield Resin Layer Adhesion on Electronic Component Ridge Lines
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Solution Overview
Problem
Existing methods for forming a shield layer on electronic components that extends to the bottom surface are prone to disconnection at the ridge line between the side and bottom surfaces, leading to inadequate electromagnetic shielding.
Innovation Solution
A method involving a temporary fixation material and an elastic layer to apply pressure to a shield resin layer, ensuring it adheres from the upper surface to the bottom surface via the side surface, with the resin layer being thicker than the component body and rounded at ridge lines to prevent disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sputtering is used to form the shield layer extending to the bottom surface, then the electromagnetic shield effect is improved, but the shield layer may separate or disconnect on the ridge line portion
Solution Approach 1:
The invention applies curvature to the ridge line portion of the substrate, forming a rounded surface instead of a sharp corner. This curved surface allows the shield layer to be formed continuously without separation or disconnection, as the sputtering process can uniformly deposit material on the curved surface, eliminating the discontinuity problem at the ridge line while maintaining electromagnetic shielding effectiveness.
2Reliability
If the shield layer is formed to extend to the bottom surface, then the electromagnetic shield effect is increased, but the manufacturing complexity increases
Solution Approach 1:
The invention performs preliminary action by pre-forming the rounded ridge line portion on the substrate before applying the shield layer. This preliminary shaping of the substrate surface simplifies the subsequent shield layer formation process, as the curved surface naturally guides continuous material deposition without requiring complex masking or multi-step processes to ensure continuity at the ridge line.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a reliable shield effect that extends to the bottom surface, reducing the likelihood of disconnection and enhancing electromagnetic shielding while allowing efficient heat dissipation and reducing thermal degradation.
Implementation Method 1
applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere
Implementation Method 2
reducing the likelihood of disconnection and enhancing electromagnetic shielding while allowing efficient heat dissipation and reducing thermal degradation
Data Source
AI summary
A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.