Shielded Busbar Layout for Noise-Resistant Power Modules
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Solution Overview
Problem
Existing semiconductor apparatuses fail to prevent radiation noise generated outside the sealing material from affecting the control substrate.
Innovation Solution
A semiconductor apparatus is designed with a shield plate positioned between the sealing material and the control substrate, extending to cover exposed busbars and potentially the capacitor module, to shield against radiation noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield plate is disposed only on the upper surface electrode side and sealed with sealing material, then radiation noise from the semiconductor device is suppressed, but radiation noise generated outside the sealing material cannot be prevented
Solution Approach 1:
The shield plate is divided into two functional zones: a first shield plate portion positioned within the sealing material to shield radiation from the semiconductor device, and a second shield plate portion extending outside the sealing material to shield radiation from external sources. This segmentation allows each portion to address specific radiation sources independently, achieving comprehensive protection.
Solution Approach 2:
The shield plate extends from a two-dimensional configuration within the sealing material to a three-dimensional structure that protrudes outside the sealing material. This dimensional extension enables the shield to cover both internal and external radiation sources, transforming the protection scope from localized to comprehensive spatial coverage.
2Object-affected harmful factors
If the shield plate is extended to cover exposed busbars, then radiation noise protection is improved, but device complexity increases
Solution Approach 1:
The shield plate serves multiple functions simultaneously: it shields radiation from the semiconductor device, shields external radiation sources, covers exposed busbars to prevent arcing, and provides structural support. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity despite enhanced protection capabilities.
Solution Approach 2:
The shield plate is merged with the sealing material structure, where the first portion is integrated within the sealing material and the second portion extends outward. This merging approach combines the shielding function with the existing sealing structure, avoiding the need for completely separate shielding components and thus limiting complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield plate effectively prevents radiation noise from reaching the control substrate, enhancing the semiconductor apparatus's performance and reliability.
Implementation Method 1
a shield plate disposed between the sealing material and the control substrate, and configured to shield against radiation
Data Source
AI summary
A semiconductor apparatus includes: a semiconductor device; a control terminal; first and second main terminals respectively connected to first and second main electrodes of the semiconductor device; a sealing material; a capacitor module; a first busbar connected to a first electrode of the capacitor module, and connected to the first main terminal outside the sealing material; a second busbar connected to a second electrode, and connected to the second main terminal outside the sealing material; a control substrate disposed on an upper surface of the sealing material; and a shield plate disposed between the sealing material and the control substrate. The shield plate is extended to cover exposed portions of the first and second busbars not covered with a housing of the capacitor module, or is bent to cover a side surface of the control substrate near the exposed portions.