Shielded Capacitive Elements for High-Speed A/D Conversion

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Solution Overview

Problem

Existing analog-to-digital converters in robots with solid-state imaging devices face accuracy issues due to variations in capacitance values caused by parasitic capacitances and manufacturing misalignments, which hinder high-speed imaging capabilities.

Innovation Solution

The design includes a comparison circuit with capacitive elements having a predetermined capacitance ratio, where the second electrodes of these elements are shielded between the first and third electrodes to reduce parasitic capacitances, and a selection circuit configuration that maintains the capacitance ratio accuracy, enabling high-speed A/D conversion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the capacitance value of capacitive elements is reduced to achieve higher conversion rate, then the A/D conversion speed increases, but the influence of parasitic capacitance increases and conversion accuracy deteriorates

Engineering Contradiction:
ImproveA/D conversion rateVSAvoidA/D conversion accuracy
Core Design Contradiction:
SpeedVSMeasurement precision

Solution Approach 1:

The patent introduces a shielding electrode that converts the harmful parasitic capacitance effect into a beneficial shielding effect. The shielding electrode is positioned between the first electrode and the second electrode of the capacitive element, creating a shielded structure that reduces the influence of external parasitic capacitance on the A/D conversion accuracy while maintaining the reduced capacitance value for high-speed conversion.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The shielding electrode acts as an intermediary element between the capacitive elements and the external environment. This intermediate structure isolates the capacitive elements from external electromagnetic interference and parasitic capacitance sources, thereby improving conversion accuracy without sacrificing conversion speed.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of time

If the capacitance value of capacitive elements is reduced to decrease sampling time, then the imaging speed increases, but the A/D conversion accuracy deteriorates due to increased parasitic capacitance influence

Engineering Contradiction:
Improvesampling timeVSAvoidA/D conversion accuracy
Core Design Contradiction:
Loss of timeVSMeasurement precision

Solution Approach 1:

The shielding electrode structure converts the harmful effect of parasitic capacitance into a beneficial shielding effect, enabling the use of reduced capacitance values for faster sampling while maintaining accuracy through the protective shielding mechanism.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The shielding electrode serves as an intermediary protective layer that allows the capacitive elements to operate at reduced capacitance values for fast sampling, while the shielding structure mediates the interaction with external parasitic capacitance sources to maintain conversion accuracy.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If the capacitance ratio between capacitive elements is maintained for accuracy, then the A/D conversion precision improves, but the device complexity increases due to additional shielding structures

Engineering Contradiction:
Improvecapacitance ratio accuracyVSAvoidcapacitive element structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The capacitive element is segmented into multiple distinct components: a first electrode, a second electrode, and a shielding electrode positioned between them. This segmentation allows each component to perform its specific function independently - the first and second electrodes maintain the capacitance ratio for accuracy, while the shielding electrode reduces parasitic capacitance influence, thereby achieving high precision without excessive overall complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances A/D conversion accuracy, reduces sampling and conversion times, and supports high-speed imaging in robots by minimizing the influence of parasitic capacitances and manufacturing errors.

Implementation Method 1

capacitive elements each of which has a first end connected to the first terminal of the comparison circuit via a first line, and includes: a first to an m-th capacitive element (where m is an integer of 2 or more) that each have a predetermined capacitance ratio

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

a second electrode disposed between the first electrode and the third electrode, above the semiconductor substrate, to oppose the first electrode and the third electrode and electrically connected to the first end

Methodology Applied
Scientific EffectParasitic capacitance: Parasitic Capacitance

Data Source

PatentUS10771085B2Robot, analog-to-digital converter, and solid-state imaging device
Publication Date: 2020.09.08 SEIKO EPSON CORP
  • US10771085B2 patent drawing
  • US10771085B2 patent drawing
  • US10771085B2 patent drawing

AI summary

An analog-to-digital converter includes: a first to an (m+1)-th capacitive element each of which has a first end connected to a first terminal of a comparison circuit and have a predetermined capacitance ratio; and selection circuits which are connected to second ends of the capacitive elements, respectively. Each of the capacitive elements includes: a first electrode disposed in a semiconductor substrate and electrically connected to the second end; a third electrode disposed above the semiconductor substrate to oppose the first electrode and electrically connected to the second end; a second electrode disposed between the first electrode and the third electrode, above the semiconductor substrate, and electrically connected to the first end; a first insulation film disposed between the first and second electrodes; and a second insulation film disposed between the third and second electrodes.