Shielded Capacitor Structure for Lower Parasitic Capacitance

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Solution Overview

Problem

Capacitor structures experience reduced quality factor and increased energy losses due to parasitic capacitance generated between electrodes and substrates, leading to poor performance.

Innovation Solution

Incorporating a shielding layer between the electrodes and the substrate in the capacitor structure, which reduces parasitic capacitance by having a lower resistance than the substrate, thereby enhancing the quality factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a capacitor is disposed directly on a substrate, then the structure is simple, but parasitic capacitance is generated between the electrodes and substrate reducing quality factor

Engineering Contradiction:
Improvecapacitor structureVSAvoidquality factor
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

An insulating layer is introduced as an intermediary between the capacitor electrodes and the substrate. This insulating layer acts as a mediator that prevents direct electrical interaction between the electrodes and substrate, thereby eliminating parasitic capacitance while maintaining structural simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful parasitic capacitance effect is extracted and eliminated by separating the capacitor electrodes from the substrate through the insulating layer. This removes the unwanted electrical coupling between electrodes and substrate while preserving the capacitor's primary function.

Inventive Principle:
Principle #2Taking out (Extraction)

2Area of stationary object

If electrodes are placed close to substrate for compact design, then area is reduced, but parasitic capacitance increases causing energy losses

Engineering Contradiction:
Improvecapacitor areaVSAvoidenergy loss
Core Design Contradiction:
Area of stationary objectVSLoss of energy

Solution Approach 1:

The insulating layer serves as a protective intermediary that enables compact capacitor design while preventing energy losses. It allows the electrodes to be positioned close to the substrate for miniaturization without creating harmful parasitic capacitance that would cause energy dissipation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The shielding layer effectively prevents parasitic capacitance with a lower quality factor, resulting in improved performance and efficiency of the capacitor structure with reduced energy losses.

Implementation Method 1

parasitic capacitance is generated between the electrodes of the capacitor and the substrate

Methodology Applied
Scientific EffectParasitic capacitance: Parasitic Capacitance

Implementation Method 2

resistance of the shielding layer is less than resistance of the substrate

Methodology Applied
Scientific EffectElectrical resistance: Electrical Resistance

Data Source

PatentUS20240071901A1Capacitor structure and semiconductor structure
Publication Date: 2024.02.29 POWERCHIP SEMICON MFG CORP
  • US20240071901A1 patent drawing
  • US20240071901A1 patent drawing
  • US20240071901A1 patent drawing

AI summary

A capacitor structure including a substrate, an insulating layer, a capacitor, a shielding layer, a first connection terminal, and a second connection terminal is disposed. The insulating layer is disposed on the substrate. The capacitor includes a first electrode layer, a second electrode layer, a dielectric layer. The first electrode layer is disposed on the insulating layer. The second electrode layer is disposed on the first electrode layer. The dielectric layer is disposed between the first electrode layer and the second electrode layer. The shielding layer is disposed in the insulating layer. The shielding layer is located between the first electrode layer and the substrate. The first connection terminal is electrically connected to the first electrode layer. The second connection terminal is electrically connected to the second electrode layer.