Shielded Interconnection Structure for Semiconductor Package EMI Control
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Solution Overview
Problem
Wireless communication modules in electronic devices experience electromagnetic interference (EMI) that adversely affect adjacent electronic modules, necessitating improved electromagnetic interference shielding in semiconductor packages.
Innovation Solution
A shielded interconnection structure with a dielectric base and a shielding layer that covers lateral and top surfaces of conductive pillars, directing induced EMI currents to ground while allowing signal transmission through exposed pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive structures (e-bar) are used to electrically connect wireless communication modules with other modules, then electrical connectivity is achieved, but electromagnetic interference is generated that disturbs adjacent electronic modules
Solution Approach 1:
A dielectric base is introduced as an intermediary between the conductive pillars and the surrounding environment. This dielectric base isolates the electromagnetic fields generated by the conductive pillars, preventing them from directly interfering with adjacent electronic modules while maintaining electrical connectivity functionality.
Solution Approach 2:
A shielding layer is formed as a thin film structure covering the conductive pillars. This shielding layer acts as a protective barrier that blocks electromagnetic interference propagation while allowing the conductive pillars to maintain their electrical connection function. The shielding layer is integrated with the dielectric base to create a compact EMI shielded structure.
2Object-generated harmful factors
If a shielding layer is added to cover conductive structures, then electromagnetic interference shielding is improved, but device complexity increases
Solution Approach 1:
The shielding layer and dielectric base are merged into a single integrated structure. The shielding layer is formed directly on the conductive pillars and extends into the dielectric base, creating a unified EMI shielded structure that reduces manufacturing steps and structural complexity compared to separate shielding components.
Solution Approach 2:
The dielectric base serves multiple functions: it provides electrical insulation, mechanical support for the conductive pillars, and forms part of the EMI shielding structure when combined with the shielding layer. This multi-functionality reduces the need for additional separate components, thereby simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively reduces EMI propagation, enhancing the performance of sensitive electronic components by shielding them from interference and maintaining signal integrity.
Implementation Method 1
directing induced EMI currents to ground while allowing signal transmission through exposed pillars
Data Source
AI summary
A shielded interconnection structure, a method for forming the shielded interconnection structure and a semiconductor package including the shielded interconnection structure are formed. The shielded interconnection structure may include: a dielectric base having a top surface, a bottom surface, and a lateral surface extending between the top surface and the bottom surface; a plurality of conductive pillars extending through the dielectric base; and a shielding layer having a lateral portion and a top portion formed as a whole, wherein the lateral portion of the shielding layer covers the lateral surface of the dielectric base, and the top portion of the shielding layer is formed on the top surface of the dielectric base to cover a first set of conductive pillars in the plurality of conductive pillars but expose a second set of conductive pillars in the plurality of conductive pillars.