Shielded Probe System Nested EMI Thermal Isolation
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Solution Overview
Problem
Existing probe systems lack effective shielding to control environmental conditions such as thermal, light, and electromagnetic interference, which can affect the accuracy of device under test (DUT) performance measurements.
Innovation Solution
The shielded probe system incorporates an electrically conductive shielding structure, thermal shielding, and an isolation structure to create a controlled environment within the enclosure volume, providing electromagnetic shielding, thermal isolation, and precise control over environmental conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If no shielding structure is used, then the device complexity is low, but electromagnetic interference and thermal disturbances affect measurement precision
Solution Approach 1:
The patent implements nested shielding structures where an inner shielding structure is placed within an outer shielding structure, creating multiple layers of protection. The inner shielding structure shields the DUT from close-range EMI sources, while the outer shielding structure provides additional protection from ambient electromagnetic interference. This nested configuration progressively enhances measurement precision by addressing interference at multiple spatial scales without requiring a single overly complex shielding system.
Solution Approach 2:
The shielding system is segmented into distinct functional components: the outer shielding structure that encloses the testing environment, the inner shielding structure that directly surrounds the DUT, the isolation structure that electrically isolates the inner shielding from the outer shielding and translation stage, and the thermal shielding structure that addresses thermal interference. This segmentation allows each component to be optimized for its specific function while collectively providing comprehensive protection, thereby improving measurement precision without unnecessary overall complexity.
2Measurement precision
If shielding structures are added to control environmental conditions, then measurement precision improves, but device complexity increases
Solution Approach 1:
The isolation structure serves as an intermediary component that electrically isolates the inner shielding structure from both the outer shielding structure and the translation stage. This intermediary element allows the inner shielding to be independently biased or grounded without affecting the outer shielding or translation stage, enabling precise control of the immediate DUT environment while maintaining overall system manageability. The thermal shielding structure similarly acts as an intermediary to control thermal conditions between the DUT and ambient environment.
3Object-affected harmful factors
If the shielding structure is electrically connected to the enclosure and translation stage, then electromagnetic shielding is enhanced, but thermal isolation and electrical interference increase
Solution Approach 1:
The isolation structure acts as an electrical intermediary that decouples the inner shielding structure from the translation stage and outer shielding, preventing thermal conduction paths while maintaining electromagnetic shielding effectiveness. This allows the inner shielding to be independently controlled electrically without being thermally coupled to the translation stage machinery, thereby reducing thermal disturbances to the DUT while preserving EMI shielding capabilities.
Solution Approach 2:
Different parts of the shielding system have different electrical connection characteristics optimized for their local functions: the outer shielding structure is electrically connected to the enclosure for ambient EMI protection, while the inner shielding structure is electrically isolated from the translation stage to minimize thermal and electrical interference with the DUT. This local differentiation of electrical connectivity allows simultaneous optimization of electromagnetic shielding and thermal isolation at different spatial locations within the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields the DUT from ambient environmental disturbances, allowing for precise and accurate testing by maintaining controlled thermal, electromagnetic, and atmospheric conditions within the shielded volume.
Implementation Method 1
an electrically conductive shielding structure extending within the enclosure volume and defining a shielded volume that is a subset of the enclosure volume and that contains the electrically conductive support surface. The electrically conductive shielding structure extends between the electrically conductive support surface and the enclosure, the translation stage, and at least a portion of the substrate-supporting assembly
Implementation Method 2
an isolation structure that electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage
Implementation Method 3
a thermal shielding structure extending within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly
Data Source
AI summary
Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.