Shielding Frame Grounding Structure for Ultra-Thin Electronics
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Solution Overview
Problem
Conventional methods for connecting a circuit board to a metal middle frame in electronic devices require elastic conductive members, occupying internal space and increasing costs, which is not suitable for ultra-thin designs.
Innovation Solution
The circuit board is securely connected to a middle frame using a fastener with a shielding frame sandwiched between them, eliminating the need for elastic conductive members and allowing for ultra-thinness while reducing material and processing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an elastic conductive member is used to connect the shielding can and metal middle frame, then electrical connection and grounding are achieved, but internal space is occupied and device thickness increases
Solution Approach 1:
The patent removes the elastic conductive member from the grounding structure and replaces it with a direct mechanical connection method using fasteners, thereby eliminating the space occupation and thickness increase caused by the elastic conductive member while maintaining electrical connection functionality
Solution Approach 2:
The patent combines the shielding can and metal middle frame into a direct electrical connection structure through fasteners, eliminating the need for separate elastic conductive members and achieving both mechanical fixation and electrical grounding in a single integrated structure
2Reliability
If an elastic conductive member is used for grounding, then electrical connection is achieved, but material costs and processing costs increase
Solution Approach 1:
The patent eliminates the elastic conductive member from the grounding structure, removing the need for additional materials and processing steps, thereby reducing material costs and processing costs while maintaining effective grounding through direct mechanical connection
Solution Approach 2:
The fastener structure serves multiple functions simultaneously: mechanical fixation of the shielding can, electrical grounding connection, and structural support, eliminating the need for separate elastic conductive members and reducing overall production costs
3Reliability
If conventional connection methods are used, then electrical connection is achieved, but device structure becomes more complex
Solution Approach 1:
The patent merges the shielding can connection structure with the grounding structure by using fasteners that simultaneously achieve mechanical fixation and electrical connection, eliminating the need for separate elastic conductive members and simplifying the overall device structure
Solution Approach 2:
The fastener structure performs multiple functions including mechanical fixation, electrical grounding, and structural support in a single component, reducing the number of parts and simplifying the device structure compared to conventional methods that require separate elastic conductive members
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables ultra-thinness in electronic devices by eliminating the need for additional space and materials, ensuring effective grounding and reduced electromagnetic interference.
Implementation Method 1
the middle frame is directly electrically connected to the circuit board by the shielding frame to implement grounding
Data Source
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AI summary
This application discloses an electronic device, including a circuit board, a shielding frame, and a middle frame. The circuit board is provided with an electronic element. The shielding frame is disposed on the circuit board, and surrounds the electronic element. The middle frame is securely connected to the circuit board by a fastener, and the shielding frame is sandwiched between the middle frame and the circuit board, to enable the middle frame, the shielding frame, and the circuit board to be electrically connected. According to the electronic device provided in this application, the shielding frame is sandwiched between the middle frame and the circuit board. The middle frame is directly electrically connected to the circuit board by the shielding frame, to enable the electronic device to meet a design requirement of ultra-thinness. Static electricity of the circuit board may be discharged through a path formed by the shielding frame and the middle frame, to ensure that the static electricity of the circuit board is not accumulated. The shielding frame may conduct an electromagnetic signal to the middle frame, so that a residual electromagnetic signal that is parasitic on the shielding frame is reduced, and electromagnetic interference to an external electronic element and another component is further reduced.