Semiconductor Package Shielding Member Hooking Mechanism
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Solution Overview
Problem
Semiconductor chips and packages generate electromagnetic waves that cause signal interference in devices, and existing solutions fail to effectively mitigate this interference.
Innovation Solution
A semiconductor package and device design that incorporates an electromagnetic wave shielding member with a hooking mechanism, where the shielding member surrounds the semiconductor chip and is secured to the substrate using a bent lower end, providing comprehensive shielding and grounding for improved interference reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding member is added to cover the semiconductor chip, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The shielding member is integrated with the substrate by forming a hooking member that extends from the side surface of the shielding member, bends, and is embedded in the substrate. This merging of the shielding member with the substrate structure eliminates the need for separate mounting components, thereby reducing device complexity while maintaining shielding effectiveness.
Solution Approach 2:
The hooking member is formed from the side surface of the shielding member itself, creating a nested structure where the fixing mechanism is contained within the shielding member's own material. This nesting approach reduces the total component count and simplifies the overall device structure while achieving secure fixation.
2Reliability
If the shielding member is securely fixed to the substrate, then shielding performance is improved, but manufacturing complexity increases
Solution Approach 1:
The hooking member is formed directly from the side surface of the shielding member through deformation, allowing the shielding member to create its own fixing mechanism. This self-service approach eliminates the need for separate fixing components or complex assembly processes, thereby improving ease of manufacture while ensuring secure fixation and maintaining shielding performance.
3Object-affected harmful factors
If comprehensive coverage of the semiconductor chip is achieved, then electromagnetic wave shielding is improved, but device complexity increases
Solution Approach 1:
The shielding member is designed with side surfaces that can be individually formed with hooking members, allowing for modular fixation points around the semiconductor chip. This segmentation approach enables comprehensive coverage and secure fixation at multiple locations without requiring a complex overall structure, thereby improving shielding effectiveness while managing device complexity.
Data Source
AI summary
A semiconductor package includes a semiconductor chip mounted on a substrate. The semiconductor package further includes an electromagnetic wave shielding member. The electromagnetic wave shielding member includes an upper surface and a plurality of side surfaces. The electromagnetic wave shielding member surrounds an upper surface and side surfaces of the semiconductor chip. The semiconductor package further includes a hooking member formed from a deformation of a lower end of one of the side surfaces of the electromagnetic wave shielding member. The hooking member is interposed between the semiconductor chip and the substrate to fix the electromagnetic wave shielding member.