Showerhead Gas Supply Assembly for Rapid Temperature Control
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Solution Overview
Problem
Existing semiconductor wafer processing apparatuses face challenges in quickly adjusting the surface temperature of the showerhead, leading to issues such as clogging during etching and increased critical dimension bowing due to temperature control limitations.
Innovation Solution
A gas supply assembly with a heat control plate, gas distribution plate, heat transfer pad, and showerhead, which utilizes a heater and cooler to control the temperature of the showerhead by distributing process and heat regulating gases, allowing for rapid temperature adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater and cooler are built into a temperature control plate with multiple stacked plates, then temperature control capability is provided, but the overall mass increases and temperature control speed becomes slow
Solution Approach 1:
The temperature control system is segmented into multiple independent heating zones and cooling zones distributed across different plates. Each zone can be controlled independently, allowing selective activation of only the required zones for rapid temperature adjustment without heating or cooling the entire assembly.
Solution Approach 2:
Different regions of the showerhead assembly have different thermal control characteristics. The design applies heating elements in specific locations and cooling elements in other specific locations, allowing localized temperature control that responds faster than uniform temperature control of the entire assembly.
2Productivity
If the surface temperature of the showerhead is kept high, then etching process can be maintained, but clogging occurs
Solution Approach 1:
The system periodically alternates between heating and cooling cycles, or dynamically adjusts temperature between different setpoints during the etching process. This periodic temperature variation prevents polymer accumulation that leads to clogging while maintaining sufficient temperature for continuous etching operation.
Solution Approach 2:
The temperature parameter is dynamically changed during the etching process rather than maintained at a constant high value. By adjusting temperature parameters in response to process conditions, the system prevents clogging while maintaining etching productivity.
3Object-generated harmful factors
If the showerhead temperature is kept low, then clogging is reduced, but the mask becomes wider causing increased critical dimension bowing
Solution Approach 1:
The temperature control system transitions from static temperature maintenance to dynamic temperature adjustment. The system actively modulates temperature in real-time based on process feedback, allowing it to prevent clogging during certain phases while maintaining critical dimension control during other phases.
Solution Approach 2:
The temperature control system uses feedback from process monitoring to dynamically adjust showerhead temperature. By monitoring etching progress and mask condition, the system adjusts temperature to prevent both clogging and critical dimension bowing, resolving the trade-off between these two quality parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid and precise temperature control of the showerhead, reducing clogging and maintaining appropriate critical dimensions during high aspect ratio contact etching, thereby improving process efficiency and quality.
Implementation Method 1
a heater and a cooler built into a temperature control plate to control the temperature of the showerhead
Implementation Method 2
at least one heat regulating gas distribution passage configured to deliver a heat regulating gas
Implementation Method 3
a heat transfer pad below the gas distribution plate and contacting the showerhead
Implementation Method 4
a dielectric material pad, an electrode in the dielectric material pad
Implementation Method 5
an electrostatic chuck configured to support the semiconductor wafer within the process chamber and generate plasma by opposing the gas supply assembly
Data Source
AI summary
A gas supply assembly includes: a heat control plate including a heater and a cooler; a gas distribution plate below the heat control plate and including a process gas distribution passage with process gas delivered therethrough and a heat regulating gas distribution passage with heat regulating gas delivered therethrough; a heat transfer pad below the gas distribution plate and including a dielectric material pad including an electrode therein; and a showerhead including a spraying nozzle in communication with the process gas distribution passage and discharging the process gas. The heat transfer pad further includes a process gas movement channel in communication with the process gas distribution passage of the gas distribution plate and a heat regulating gas movement channel in communication with the heat regulating gas distribution passage of the gas distribution plate.