Shutter and Deposition Shield Cooling via Integrated Flow Paths
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Solution Overview
Problem
In plasma processing apparatuses, the increased heat input from high-frequency bias power leads to temperature control challenges and potential component deterioration, particularly in miniaturized and highly integrated systems with high aspect ratio features, where the potential difference between plasma and grounded components increases ion sputtering and heat consumption.
Innovation Solution
The integration of flow paths for a coolant within the shutter and deposition shield, equipped with heat exchange accelerating members, allows for efficient temperature control by circulating a heat exchange medium, maintaining components within a preset temperature range and improving thermal responsiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-frequency bias power is increased to improve plasma processing capability, then processing efficiency is improved, but temperature control becomes difficult and component deterioration occurs
Solution Approach 1:
A heat exchange medium is introduced as an intermediary substance to transfer heat away from components. The medium circulates through heat exchange portions of the shutter and deposition shield, absorbing excess heat generated by high-frequency bias power and preventing component overheating and deterioration.
Solution Approach 2:
A liquid heat exchange medium is circulated through hydraulic flow paths formed in the shutter and deposition shield. This hydraulic system efficiently removes heat from components by circulating coolant through channels integrated into the component structures.
2Volume of moving object
If miniaturization and high integration are implemented to improve device density, then space utilization is improved, but ion sputtering and heat consumption increase
Solution Approach 1:
The heat exchange medium acts as an intermediary that absorbs and removes the increased heat consumption generated by miniaturized high-aspect-ratio features. This allows the system to maintain high device density while managing the associated thermal load and reducing ion sputtering effects.
Solution Approach 2:
Temperature parameters of components are actively controlled by adjusting heat exchange medium flow and temperature. This maintains component temperatures within optimal ranges, reducing ion sputtering and heat consumption even in miniaturized high-density configurations.
3Device complexity
If conventional cooling methods are used, then structure simplicity is maintained, but temperature uniformity and thermal responsiveness deteriorate
Solution Approach 1:
The cooling system is segmented into multiple heat exchange portions distributed across different components (shutter, deposition shield). Each component has its own integrated flow paths, allowing localized temperature control and improving overall temperature uniformity and thermal responsiveness.
Solution Approach 2:
Flow paths are nested within the internal structure of components. The coolant channels are integrated into the shutter and deposition shield structures themselves, combining cooling functionality with structural components and improving thermal management without significantly increasing external complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools the shutter and deposition shield, maintaining temperature control even with increased heat input, enhancing productivity, workability, and reducing material costs while improving temperature uniformity and thermal responsiveness.
Implementation Method 1
The component has a flow path through which a heat exchange medium flows
Implementation Method 2
circulating a heat exchange medium, maintaining components within a preset temperature range
Data Source
AI summary
A substrate processing apparatus includes a processing vessel; a placing table provided within the processing vessel and configured to place a substrate thereon; and a component disposed between the processing vessel and the placing table, the component constituting an anode. The component has a flow path through which a heat exchange medium flows.