Si-Coated Plate Conductive Particles for Thin MLCC External Electrodes

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Solution Overview

Problem

Existing multilayer electronic components face challenges in achieving reduced size and high capacitance due to high viscosity of external electrode paste, which affects electrode thickness and stability, leading to weakened mechanical strength and reliability issues.

Innovation Solution

Incorporating plate-shaped conductive particles with a coating layer containing Si and Al, with a content of 0.3 to 2.0 at %, to control sintering reduction and improve electrode coverage and connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the paste for external electrode is applied by reduced thickness to meet miniaturization demand, then the size of multilayer electronic component is reduced, but the mechanical strength and contact properties deteriorate

Engineering Contradiction:

Improvesize of multilayer electronic componentVSAvoidmechanical strength of external electrode

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent changes the physical and chemical parameters of conductive particles by coating their surfaces with glass particles. This coating modifies the sintering behavior, melting characteristics, and bonding properties of the particles, enabling reduced electrode thickness while maintaining mechanical strength through controlled sintering reduction and enhanced adhesion to internal electrodes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure by coating conductive particles with glass particles. This composite approach combines the electrical conductivity of metal particles with the sintering control and mechanical strength properties of glass, achieving both miniaturization and structural integrity

Inventive Principle:

Principle #40Composite materials

2Length of moving object

If the size of conductive particles is reduced to lower application thickness, then the electrode thickness is reduced, but contact properties with internal electrode deteriorate

Engineering Contradiction:

Improvethickness of external electrodeVSAvoidcontact properties with internal electrode

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent changes the sintering parameters of conductive particles through glass coating, which controls the reduction rate during sintering. This ensures that even with reduced particle size and electrode thickness, the particles maintain adequate contact pressure and electrical contact properties with internal electrodes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The glass coating acts as an intermediary layer between the conductive particle core and the surrounding environment. During sintering, this glass layer melts and forms a bonding matrix that enhances adhesion to internal electrodes while maintaining electrical conductivity pathways

Inventive Principle:

Principle #24Intermediary (Mediator)

3Length of moving object

If sintering reduction is not controlled, then the external electrode can be applied thinner, but corner coverage is weakened and plating coverage is compromised

Engineering Contradiction:

Improvethickness of external electrodeVSAvoidcorner coverage and plating coverage

Core Design Contradiction:

Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the sintering behavior parameters by coating conductive particles with glass, which has a specific melting point and softening characteristics. This controls the reduction rate during sintering, preventing excessive shrinkage that would compromise corner coverage and plating coverage while allowing reduced electrode thickness

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the reliability and capacitance of multilayer electronic components by preventing electrode breakage and ensuring uniform electrode coverage, thus maintaining structural integrity and electrical connectivity.

Implementation Method 1

the plurality of conductive particles include first conductive particles, wherein the first conductive particles are plate-shaped conductive particles having a coating layer disposed on a surface thereof, and wherein the coating layer includes Si, and an Si content is 0.3 at % or more and 2.0 at % or less

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 2

a thickness of a corner of the external electrode may decrease due to sintering reduction occurring during a sintering process

Methodology Applied

Scientific EffectSintering reduction:

Data Source

PatentUS12451294B2Multilayer electronic component containing coated conductive particles and method of manufacturing the multilayer electronic component

Publication Date: 2025.10.21 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes disposed to oppose each other with the dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and including a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles, wherein the first conductive particles are plate-shaped conductive particles having a coating layer formed on a surface thereof, and wherein the coating layer includes Si, and an Si content is 0.3 at % or more and 2.0 at % or less, as compared to the plate-shaped conductive particles.