SiC Semiconductor Component Barrier Structures for Defect Blocking

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Solution Overview

Problem

SiC semiconductor components face challenges in achieving low on-resistance and high dielectric strength, particularly in dissipating electric fields and preventing avalanche robustness and breakdown, due to weakly doped drift zones and propagation of crystal defects.

Innovation Solution

The semiconductor component incorporates barrier structures that extend from a semiconductor region into the drift zone, differing structurally from gate structures, to physically block crystal defects and enhance the blocking capability, thereby improving the semiconductor's robustness and reducing static losses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the drift zone is weakly doped to achieve high dielectric strength and breakdown capability, then the blocking capability is improved, but the on-resistance increases and static losses increase

Engineering Contradiction:
Improvedielectric strengthVSAvoidstatic losses
Core Design Contradiction:
StrengthVSLoss of energy

Solution Approach 1:

The patent introduces barrier structures with different doping concentrations and material compositions at specific locations within the drift zone. These localized regions have enhanced electrical properties that reduce on-resistance without compromising the overall dielectric strength of the weakly doped drift zone. The barrier structures create local variations in charge carrier concentration and mobility, improving conductivity where needed while maintaining high blocking capability in the bulk drift region.

Inventive Principle:
Principle #3Local quality

2Strength

If the drift zone is weakly doped to improve breakdown strength, then the avalanche robustness is improved, but the crystal defect propagation is more likely to occur

Engineering Contradiction:
Improvebreakdown strengthVSAvoidavalanche robustness
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent employs composite material structures combining different semiconductor materials (such as SiC and AlN) in the barrier structures within the drift zone. These composite regions provide enhanced crystal defect tolerance and suppress defect propagation while maintaining the high breakdown strength of the weakly doped drift zone. The different materials have complementary properties that collectively improve avalanche robustness against crystal defects.

Inventive Principle:
Principle #40Composite materials

3Reliability

If barrier structures are introduced to block crystal defects and improve breakdown strength, then the avalanche robustness is improved, but the device complexity increases

Engineering Contradiction:
Improveavalanche robustnessVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the drift zone into multiple regions with barrier structures strategically positioned at specific depths and lateral locations. These segmented barrier regions are distributed throughout the drift zone to provide comprehensive crystal defect blocking. The segmentation approach allows the complex function of defect suppression to be achieved through multiple simpler, localized structures rather than a single complex barrier system.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11063144B2Silicon carbide semiconductor component
Publication Date: 2021.07.13 INFINEON TECHNOLOGIES AG
  • US11063144B2 patent drawing
  • US11063144B2 patent drawing
  • US11063144B2 patent drawing

AI summary

A semiconductor component includes a SiC semiconductor body. A drift zone of a first conductivity type and a semiconductor region are formed in the SiC semiconductor body. Barrier structures extending from the semiconductor region into the drift zone differ from the gate structures.