Segmented Electrode Covering for Reliable SiC MISFET Connections
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving efficient electrical connections and protection of electrodes in semiconductor substrates, particularly in wide bandgap semiconductor devices like SiC-MISFETs, due to the complexity of layer structures and material compatibility.
Innovation Solution
The semiconductor device employs a SiC monocrystal with specific off-angle orientations and layered semiconductor regions, combined with trench-type gate and source structures, to enhance electrical connectivity and protection of electrodes, utilizing insulating films and embedded electrodes for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex layered structures are used to protect electrodes and achieve electrical connections, then reliability is improved, but device complexity increases
Solution Approach 1:
The protective layer system is segmented into multiple functional layers: a first protective layer (inorganic) applied directly to the electrode, and a second protective layer (organic) applied over the first protective layer and interlayer insulating layer. This segmentation allows each layer to perform its specific function optimally while maintaining overall reliability.
Solution Approach 2:
The first protective layer acts as an intermediary between the electrode and the second protective layer, providing direct adhesion to the electrode and serving as a barrier layer. The second protective layer then provides additional protection and planarity. This intermediary structure resolves the contradiction by distributing protective functions across multiple layers rather than requiring a single complex layer.
2Reliability
If multiple protective layers are applied to cover electrodes and insulating layers, then electrode protection is improved, but manufacturing complexity increases
Solution Approach 1:
The first protective layer is applied to the electrode and patterned before the interlayer insulating layer is formed. This preliminary action ensures proper electrode protection and adhesion before subsequent layers are added, simplifying the overall manufacturing process by establishing the protective structure early in the fabrication sequence.
Solution Approach 2:
The first protective layer is selectively applied only to regions where electrode protection is needed, with different patterns and thicknesses in different areas. This local quality approach allows optimized protection where required while reducing material usage and manufacturing complexity in other areas.
Data Source
AI summary
An electronic component includes a covered object, an electrode that is arranged on the covered object and has an electrode side wall on the covered object, a wiring that is arranged on the covered object in a periphery of the electrode, an inorganic film with an insulating property that has an inner covering portion covering the electrode so as to expose the electrode side wall and an outer covering portion covering the wiring at an interval from the inner covering portion, and an organic film with an insulating property that extends across the inner covering portion and the outer covering portion and covers the electrode between the inner covering portion and the outer covering portion.