Side-by-Side LED With Separate Electrical and Heat Transfer Paths
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Solution Overview
Problem
Existing optoelectronic systems, such as LED displays, face reliability issues due to cumulative heat gain when heat conductive components are used for electrical paths or are in close proximity, leading to reduced lifespan and signal errors.
Innovation Solution
A side-by-side light emitting diode design with separate electrical and heat transfer paths, utilizing a thermal conductive substrate with an electrically insulating isolation layer to keep heat and electrical paths distinct, allowing for efficient heat dissipation without compromising electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat conductive components are used for electrical paths, then electrical conductivity is improved, but heat dissipation deteriorates due to cumulative heat gain
Solution Approach 1:
The patent divides the substrate into distinct functional regions: an electrical path region with conductive material for current flow, and a heat transfer path region with thermally conductive material for heat dissipation. This segmentation allows each path to perform its specific function without interference, resolving the contradiction between electrical conductivity and heat dissipation.
Solution Approach 2:
The patent extracts the heat transfer function from the electrical path by creating a separate heat transfer path through the substrate. The electrical path is taken out from being the sole conductor and is dedicated only to electrical current, while heat is routed through the dedicated thermal path to the heat sink, eliminating cumulative heat gain in electrical components.
2Temperature
If heat conductive components are in close proximity to electrical paths, then heat dissipation is improved, but electrical reliability deteriorates due to thermal interference
Solution Approach 1:
The patent segments the substrate into distinct electrical and thermal zones with different material properties. The electrical path region uses conductive materials optimized for current flow, while the heat transfer path region uses thermally conductive materials optimized for heat dissipation. This spatial segmentation prevents thermal interference with electrical signals while maintaining effective heat dissipation.
Solution Approach 2:
The patent applies local quality by assigning different material properties to different regions of the substrate. The electrical path region has high electrical conductivity, while the heat transfer path region has high thermal conductivity. This localized optimization allows each region to perform its specific function effectively without compromising the other.
3Reliability
If separate electrical and heat transfer paths are implemented, then heat dissipation and electrical reliability are improved, but device complexity increases
Solution Approach 1:
The patent uses a single substrate that serves multiple functions: it provides mechanical support, conducts electricity through dedicated electrical paths, and dissipates heat through dedicated thermal paths. By making the substrate multi-functional, the patent achieves separate electrical and heat transfer paths without proportionally increasing overall device complexity.
Solution Approach 2:
The patent merges the electrical path and heat transfer path into a single integrated substrate structure. Rather than using separate components for electrical conduction and heat dissipation, both functions are combined within the substrate itself, reducing the number of discrete parts while maintaining functional separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of LED systems by preventing heat from affecting electrical paths, thereby extending the lifespan and reducing the risk of accidental firing and signal errors.
Implementation Method 1
a thermal conductive substrate having at least one electrical isolation layer configured to provide a heat transfer path through the substrate from a front side (first side) to a back side (second side)
Implementation Method 2
The light emitting diodes (LEDs) can generate a large amount of heat that must be dissipated
Data Source
AI summary
A method for fabricating a light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect.