Side-emitting LED Package with Integrated Reflective Layer
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Solution Overview
Problem
Conventional side-emitting LED packages face limitations in reducing thickness, are inefficient in terms of productivity due to complex manufacturing processes, and suffer from light scattering issues due to non-focused light transmission surfaces.
Innovation Solution
A side-emitting LED package design featuring a substrate with electrodes, a molded part covered by a reflective layer, and a light transmitting surface formed on one side, utilizing Epoxy Molding Compound (EMC) transfer molding to minimize color dispersion and enable mass production without additional molded materials, allowing for compact size and adaptability to LED chip size variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a molded body covers a lead frame with LED chip to form a side-emitting LED package, then the package structure is protected and assembled, but the thickness is limited to be about 0.5 T and cannot be reduced further
Solution Approach 1:
The patent transitions from a conventional top-emitting structure to a side-emitting structure by changing the light emission dimension. The LED chip is positioned to emit light sideways through the lead frame, and the molded body is configured to expose the side surface as the light transmitting surface, thereby reducing the thickness dimension while maintaining protective functionality.
Solution Approach 2:
The molded body is designed as a thin-film structure that covers and protects the LED chip and lead frame while minimizing thickness. The molded body conforms to the side-emitting geometry, providing protection in a ultra-thin profile that enables the overall package thickness to be reduced to about 0.5T or less.
2Ease of manufacture
If a retainer and reflecting surface are prepared separately to wrap around the lens, then the light reflection and transmission functions are achieved, but the manufacturing process becomes complicated and cumbersome
Solution Approach 1:
The patent combines the functions of the retainer, lens, and reflecting surface into an integrated molded body structure. The molded body simultaneously provides mechanical support, optical focusing, and light reflection functions through its unified design, eliminating the need for separate components and simplifying the manufacturing process to a single molding operation.
Solution Approach 2:
The molded body is designed as a multi-functional component that performs multiple roles: it acts as a protective cover, a structural retainer, a light-focusing lens, and a reflecting surface. This universal design consolidates several functions into one element, greatly simplifying manufacturing while maintaining all necessary optical and mechanical functions.
3Illumination intensity
If the light transmitting surface is not formed in one particular direction, then the light emission covers multiple directions, but the reflected light is scattered and not focused
Solution Approach 1:
The molded body is designed with different optical properties in different regions: one surface is configured as a light transmitting surface with specific directional characteristics for focused light emission, while other surfaces have reflecting properties. This local differentiation of optical quality enables focused light transmission in the desired direction while maintaining appropriate light distribution characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves minimal thickness, improved productivity, and focused light emission with reduced color dispersion, enabling efficient mass production and adaptation to various miniaturized electronic devices.
Implementation Method 1
a reflective layer covering an outer surface of the molded part
Implementation Method 2
a light source electrically connected to the electrode and disposed on the substrate
Implementation Method 3
adopts Epoxy Molding Compound (EMC) transfer molding to minimize color dispersion
Data Source
AI summary
The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.