Multilayer Electronic Component Side Margin for Moisture Resistance
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Solution Overview
Problem
The challenge is to prevent moisture penetration through the side margin portion of multilayer ceramic capacitors, which can lead to deterioration of insulation resistance, especially in compact electronic devices with reduced spacing between components.
Innovation Solution
Incorporating a side margin portion with a mole ratio of transition metal to Sn of 10 or more, which enhances moisture resistance reliability by trapping holes and preventing hydration-induced insulation resistance deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a side margin portion is formed on the side surface of the body to improve capacitance, then capacitance is improved, but moisture penetration occurs through the side margin portion causing insulation resistance deterioration
Solution Approach 1:
The patent applies local quality by forming a side margin portion with a specific composition (Sn and transition metal with mole ratio of 10 or more) only at the side surfaces of the multilayer electronic component. This localized compositional modification provides moisture resistance precisely where needed (at the side margins) while maintaining the overall capacitance-improving structure. The side margin portion has different chemical composition and properties compared to the bulk material, creating a protective barrier exactly where moisture penetration is most likely to occur.
2Volume of moving object
If electronic products are designed with reduced size and reduced spacing between components, then miniaturization is achieved, but moisture penetration risk increases due to reduced space for protective structures
Solution Approach 1:
The patent changes the chemical composition parameters of the side margin portion by incorporating Sn and transition metal elements with a specific mole ratio of 10 or more. This compositional parameter change creates a material with enhanced moisture resistance properties. By modifying the chemical parameters (elemental composition and ratios) rather than changing the physical dimensions or adding external protective structures, the patent achieves moisture resistance in miniaturized components without increasing overall size or requiring additional protective layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents insulation resistance deterioration under wet environments, ensuring high moisture resistance reliability and maintaining miniaturization and high capacitance in multilayer electronic components.
Implementation Method 1
a mole ratio of the transition metal to Sn in the side margin portion is 10 or more... trapping holes and preventing hydration-induced insulation resistance deterioration
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a side margin portion disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, wherein the side margin portion includes Sn and a transition metal, and wherein, in the side margin portion, a mole ratio of transition metal to Sn is 10 or more.