Side Pad Structure for Thin Bezel Display Panels

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Solution Overview

Problem

Conventional display apparatuses have a thick bezel due to the large pad area required for connecting signal lines to flexible printed circuit boards, which increases manufacturing time, cost, and reduces yield.

Innovation Solution

The display apparatus features guiding dams and side pads with a conductive paste that moves into connection areas between the dams, forming horizontal and vertical portions to connect signal lines to flexible printed circuit boards, reducing the pad area and bezel thickness, and using an anisotropic conductive film for connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a large pad area is used to connect signal lines to flexible printed circuit boards, then connection reliability is improved, but bezel thickness increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidbezel thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The side pad structure extends vertically from the front surface to the rear surface of the substrate, utilizing the third dimension (depth/thickness) to achieve connection functionality without increasing the horizontal pad area on the front surface. This vertical extension allows the signal line to connect to the flexible printed circuit board through the thickness of the substrate, thereby reducing bezel thickness while maintaining connection reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a large pad area is used for connecting signal lines, then manufacturing simplicity is maintained, but manufacturing time and cost increase while yield decreases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmanufacturing efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The pad structure is segmented into distinct components: the horizontal portion on the front surface, the vertical portion extending through the substrate thickness, and the connection interface with the flexible printed circuit board. This segmentation allows each part to be optimized independently and simplifies the manufacturing process by enabling standardized fabrication steps for each segment, thereby improving manufacturing efficiency and yield.

Inventive Principle:
Principle #1Segmentation

3Length of stationary object

If the bezel thickness is reduced, then device compactness is improved, but the pad area for connecting signal lines becomes insufficient

Engineering Contradiction:
Improvebezel thicknessVSAvoidpad area
Core Design Contradiction:
Length of stationary objectVSArea of stationary object

Solution Approach 1:

The invention transitions from a two-dimensional pad area on the front surface to a three-dimensional side pad structure that extends vertically through the substrate. This dimensional change allows the effective pad area to be maintained or increased through the vertical dimension while the horizontal footprint on the front surface is reduced, enabling thinner bezels without compromising connection capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the bezel thickness, improves manufacturing efficiency, and enhances the connection quality between signal lines and flexible printed circuit boards, leading to cost savings and increased yield.

Implementation Method 1

forming a first horizontal portion of a first side pad in the connection area between the first and second guiding dams

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

using an anisotropic conductive film for connection

Methodology Applied
Scientific EffectAnisotropic conduction: Anisotropy

Data Source

PatentUS11183517B2Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same
Publication Date: 2021.11.23 SAMSUNG DISPLAY CO LTD
  • US11183517B2 patent drawing
  • US11183517B2 patent drawing
  • US11183517B2 patent drawing

AI summary

A display apparatus includes a first base substrate defining: an outer edge thereof at which a side surface is exposed, and an upper surface thereof connected to the outer edge; first and second guiding dams on the upper surface and extending from an inside of the first base substrate to the outer edge; a first signal line on the upper surface and extending between the first and second guiding dams from the inside of the first base substrate to the outer edge thereof; and a first side pad connected to the first signal line. The first side pad includes a first horizontal portion on the upper surface and extending between the first and second guiding dams, in a top plan view, and the first horizontal portion extending to define a first vertical portion which is disposed on the side surface.