Side Terminal Display Device Bezel Reduction
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Solution Overview
Problem
Conventional display devices have a large bezel due to the bonding of driving chips or flexible printed circuit boards on the upper surface of the display panel, which increases the peripheral area and can lead to damage of transfer wiring during processing.
Innovation Solution
A display device with a side terminal and transfer wiring that is exposed outside the panel, allowing for a conductive side pad to connect an external driving device, reducing the bezel size and minimizing damage to the transfer wiring by not exposing it to the side surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driving chip or flexible printed circuit board is bonded on the upper surface of the display panel, then electrical connection is achieved, but the bezel size increases
Solution Approach 1:
The patent moves the electrical connection interface from the upper surface (2D plane) to the side surface of the display panel, utilizing the third dimension (depth/thickness) to relocate bonding pads and driving circuits. This allows the connection to occur laterally rather than vertically, reducing the horizontal space required for the bezel.
Solution Approach 2:
Instead of bonding the driving chip on top of the display panel as in conventional designs, the patent inverts the approach by exposing the side surface of the panel and bonding the driving chip to the side surface, thereby inverting the traditional bonding orientation.
2Reliability
If transfer wiring is exposed to the side surface during processing, then connection is achieved, but the transfer wiring is damaged
Solution Approach 1:
The patent extracts the transfer wiring from the side surface exposure area by routing it through the interior of the panel to contact pads on the side surface. This separates the fragile transfer wiring from the harsh side surface processing environment, protecting it from damage while maintaining electrical connection.
Solution Approach 2:
The patent introduces intermediate contact pads as mediators between the transfer wiring and the external driving chip. The transfer wiring connects to these pads through protected internal pathways, and the pads then interface with the driving chip on the side surface, shielding the wiring from processing damage.
3Area of stationary object
If side terminal with exposed side surface is used, then bezel size is reduced, but the contact area with side pad needs to be enhanced
Solution Approach 1:
The patent segments the contact interface into multiple discrete contact pads arranged on the side surface, rather than using a single large contact area. This segmentation allows for optimized individual pad sizes and distributions that enhance total contact area while maintaining a compact side-terminal structure.
Solution Approach 2:
The patent employs nested conductive layers within the side terminal structure, where multiple conductive patterns are stacked or nested to increase the effective contact area with the side pad while maintaining a compact footprint on the side surface.
Data Source
AI summary
A display device includes: a display panel including a pixel array, a side terminal including a side surface which is exposed to outside the display panel, and a transfer wiring electrically connecting the side terminal and the pixel array to each other; and a side pad which is conductive and through which an electrical signal is provided to the side terminal from outside the display panel, the side pad contacting the display panel at the side surface of the side terminal which is exposed to outside the display panel. An end of the transfer wiring is spaced apart from the side surface of the side terminal which is exposed to outside the display panel.