Side-View Light-Emitting Structure With Lateral Heat Dissipation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing light-emitting devices have a large length between the light emission surface and the back surface, which can lead to increased size and reduced efficiency, particularly in side-view type devices.

Innovation Solution

A method of manufacturing a small light-emitting device involves forming an intermediate structure with layered bodies, including electrodes and a light-transmissive member, and then creating grooves and electrically conductive films to expose the light-reflective member, allowing for the efficient formation of multiple light-emitting devices with reduced substrate thickness and improved heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a circuit board is provided at the back-surface side of the light-emitting device, then the device structure is supported and components are mounted, but the length between the light emission surface and the back surface is increased

Engineering Contradiction:
Improvestructural supportVSAvoidlength between light emission surface and back surface
Core Design Contradiction:
StrengthVSLength of moving object

Solution Approach 1:

The patent repositions the circuit board from the back-surface side to the side surface of the light-emitting device. This dimensional change allows the circuit board to provide structural support and mount components without increasing the length between the light emission surface and back surface, thereby resolving the contradiction between structural support and compact length.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Length of moving object

If the substrate thickness is reduced to achieve a compact design, then the device size is decreased, but heat dissipation becomes more difficult

Engineering Contradiction:
Improvesubstrate thicknessVSAvoidheat dissipation
Core Design Contradiction:
Length of moving objectVSTemperature

Solution Approach 1:

The patent provides heat dissipation paths in the lateral direction by positioning heat dissipation structures at the side surfaces of the device. This allows heat to be dissipated through the side surfaces rather than requiring increased substrate thickness, thus resolving the contradiction between compact thickness and effective heat dissipation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Illumination intensity

If grooves and electrically conductive films are formed to expose the light-reflective member, then light extraction efficiency is improved and heat dissipation is enhanced, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent divides the device structure into distinct segments including grooves, electrically conductive films, and light-reflective member regions. This segmentation allows each component to be formed through specialized processes optimized for its function, improving light extraction and heat dissipation while managing manufacturing complexity through modular fabrication steps.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a smaller, more efficient light-emitting device with enhanced heat dissipation and improved light extraction efficiency, achieving a compact design while maintaining strong bonding and reduced leakage of light.

Implementation Method 1

a light-reflective member covering lateral surfaces of the layered body

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

The pair of first electrically conductive films disposed on the first surface of the structure such that each of the pair of first electrically conductive films is connected to a respective one of the pair of electrodes

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

a light-transmissive member disposed on the light-emitting element

Methodology Applied
Scientific EffectLight transmission:

Implementation Method 4

a bonding member bonding the second electrically conductive films to the mounting board

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11990560B2Method of manufacturing light-emitting device, light-emitting device, and light source device
Publication Date: 2024.05.21 NICHIA CORP
  • US11990560B2 patent drawing
  • US11990560B2 patent drawing
  • US11990560B2 patent drawing

AI summary

A light-emitting device includes: a structure including: a layered body including: a light-emitting element comprising a pair of electrodes, and a light-transmissive member disposed on the light-emitting element; and a light-reflective member covering lateral surfaces of the layered body, in which structure has a first surface at which the pair of electrodes are exposed from the light-reflective member, and a second surface connected to the first surface, the second surface being a surface of the light-reflective member. A pair of first electrically conductive films disposed on the first surface of the structure such that each of the pair of first electrically conductive films is connected to a respective one of the pair of electrodes. A pair of second electrically conductive films disposed on the second surface of the structure, each of the pair of electrically conductive films being continuous with the pair of first electrically conductive films.