Side-view LED Package with Thermosetting Resin for Thin Periphery
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Solution Overview
Problem
The challenge is to develop a side-view type light emitting apparatus with reduced size, weight, and cost, while maintaining high optical characteristics and reliability, as existing technologies face difficulties in thinning the periphery of the concave portion due to low fluidity of thermoplastic resin and issues with thermosetting resin molding.
Innovation Solution
The solution involves using a thermosetting resin, specifically triazine derivative epoxy resin, with high fluidity for the resin molding body, combined with a transfer molding process to achieve a thinner periphery and complex shape, ensuring strong adhesion and resistance to thermal expansion, and incorporating a light diffusion agent for uniform light output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermoplastic resin is used for resin molding body, then productivity is improved through injection molding, but manufacturing precision deteriorates due to low fluidity preventing thin periphery molding
Solution Approach 1:
The patent changes the material parameter from thermoplastic resin to thermosetting resin, which has superior fluidity and can be molded at lower temperatures. This enables the periphery portion to be molded with a width of 0.1mm or less while maintaining high productivity through injection molding, resolving the contradiction between mass-production efficiency and thin periphery molding capability.
2Manufacturing precision
If molding temperature is increased to improve thermoplastic resin fluidity, then manufacturing precision improves for thin periphery, but reliability deteriorates due to die release failure
Solution Approach 1:
The patent changes the material parameter from thermoplastic resin to thermosetting resin, which can be molded at lower temperatures (below the glass transition temperature) while maintaining high fluidity. This eliminates the need to increase molding temperature, thereby preventing die release failure while still achieving thin periphery portions with width of 0.1mm or less.
3Volume of moving object
If periphery portion width is reduced to minimize size, then volume is reduced, but manufacturing precision deteriorates due to molding difficulty
Solution Approach 1:
The patent changes the material parameter to thermosetting resin with superior fluidity and lower molding temperature requirements. This enables the periphery portion to be successfully molded with a width of 0.1mm or less, achieving minimal package size while maintaining high manufacturing precision and avoiding defects such as incomplete filling or deformation.
4Manufacturing precision
If thermosetting resin is used instead of thermoplastic resin, then manufacturing precision improves for thin periphery, but ease of manufacture deteriorates due to complex molding process
Solution Approach 1:
The patent changes the material parameter to thermosetting resin and adjusts the molding process parameters (temperature below glass transition temperature, appropriate pressure and time). Despite the different material characteristics, the injection molding process remains fundamentally the same, achieving thin periphery portions with width of 0.1mm or less while maintaining ease of manufacture through established molding techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a light emitting apparatus with improved optical characteristics, heat resistance, and reliability, allowing for reduced size and weight, and cost-effectiveness by preventing peeling and stress cracking, and enhancing mass-productivity.
Implementation Method 1
a fluidity of the thermoplastic resin is reduced
Implementation Method 2
incorporating a light diffusion agent for uniform light output
Implementation Method 3
ensuring strong adhesion and resistance to thermal expansion
Implementation Method 4
using a thermosetting resin, specifically triazine derivative epoxy resin
Data Source
AI summary
A surface mount lateral light emitting apparatus, which includes a light emitting device; a first lead frame connected to the light emitting device; a second lead frame connected to the light emitting device; a first resin molding body in which a concave portion for mounting the light emitting device is formed and the first lead frame and the second lead frame are fixed; and a second resin molding body which covers the light emitting device to form a light emitting surface in the concave portion of the first resin molding body, wherein the first resin molding body contains a filler or a light diffusion agent; wherein in a periphery of the concave portion, a width of at least one side of the first resin molding body is not more than 0.2 mm; and wherein the first resin molding body and the second resin molding body are formed with a thermosetting resin.