Side Wall Barrier Structure for Flexible Electronic Device Sealing
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Solution Overview
Problem
Flexible environmental sensitive electronic devices face shortened lifetimes due to moisture and oxygen infiltration through their substrates, which are not adequately sealed, failing to meet market requirements.
Innovation Solution
The implementation of a multi-layered package structure incorporating flexible and rigid substrates with embedded side wall barrier structures made of organic and inorganic materials, along with adhesives and gas barrier films, to effectively block moisture and oxygen, enhancing the sealing capabilities of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is used to hold electronic devices and act as a cover, then the device achieves bendability and portability, but moisture and oxygen infiltration occurs through the substrate, shortening device lifetime
Solution Approach 1:
The patent embeds side wall barrier structures within the flexible substrate, creating a nested configuration where the barrier structures are integrated inside the substrate layers. This nesting approach provides moisture and oxygen blocking capabilities while maintaining the substrate's flexibility and bendability, thus resolving the contradiction between adaptability and reliability
Solution Approach 2:
The patent employs composite structures combining flexible substrate materials with barrier materials having low permeability to moisture and oxygen. The multi-layered package structure integrates different materials with complementary properties - flexible materials for bendability and barrier materials for protection - thereby achieving both adaptability and reliability simultaneously
2Device complexity
If the flexible substrate serves as both structural support and protective cover, then device complexity is reduced, but moisture and oxygen blocking capability is insufficient
Solution Approach 1:
The side wall barrier structures are nested within the flexible substrate, creating an integrated multi-functional structure. This nesting provides both structural support and moisture/oxygen blocking capabilities without adding separate external components, thus maintaining low device complexity while improving protection against harmful factors
Solution Approach 2:
The flexible substrate is designed to perform multiple functions simultaneously: structural support, protective cover, and moisture/oxygen barrier. By integrating barrier functions into the substrate itself through embedded structures, the substrate becomes a multi-functional component that addresses both structural and protective requirements without increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly extends the lifetime of environmental sensitive electronic devices by effectively preventing moisture and oxygen ingress, thereby ensuring better durability and compliance with market standards.
Implementation Method 1
the second adhesive is located between the first and third substrates and covers the first side wall barrier structure
Implementation Method 2
The first adhesive is located between the first substrate and the second substrate and covers the environmental sensitive electronic device
Data Source
AI summary
An environmental sensitive electronic device package having side wall barrier structure may include a first substrate, a second substrate, an environmental sensitive electronic device, a first adhesive, a third substrate, at least one first side wall barrier structure, and a second adhesive. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located between the first and second substrates and covers the environmental sensitive electronic device. The third substrate is located below the first substrate. The first substrate is located between the second and third substrates. The first side wall barrier structure is located on the third substrate and between the first and the third substrates, wherein the first side wall barrier structure is embedded in the first substrate. The second adhesive is located between the first and third substrates and covers the second first side wall barrier structure.