Side Wall Barrier Segmentation for Flexible Electronic Device Packages
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Solution Overview
Problem
Flexible substrates used in environmental sensitive electronic devices are prone to deformation or damage when bent, leading to ineffective moisture and oxygen barrier performance, which shortens the device's lifespan due to infiltration and diffusion.
Innovation Solution
Incorporating a side wall barrier structure with flexure stress dispersing structures in predetermined flexure areas, surrounded by a filler layer, to prevent deformation and maintain barrier integrity when the device is bent, using materials like polyethylene terephthalate or metal foils, and forming the barrier layers through etching and chemical vapor deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a side wall barrier structure is formed on the flexible substrate and adhered by adhesive, then the lateral resistance to water and oxygen is improved, but the structure may be deformed or damaged when the flexible display is bent for a period of time
Solution Approach 1:
The side wall barrier structure is divided into multiple segments along the bending direction, with spacing between adjacent segments. This segmentation allows each segment to independently accommodate bending deformation while maintaining the overall barrier function, preventing the structure from being deformed or damaged during bending cycles.
Solution Approach 2:
The adhesive layer is positioned between the flexible substrate and the side wall barrier structure to provide cushioning and stress relief during bending. This beforehand cushioning protects the barrier structure from direct mechanical stress, preventing deformation and damage that would otherwise occur during repeated bending cycles.
2Adaptability or versatility
If the flexible substrate is used to hold electronic devices, then the device achieves bendability and ease of carriage, but the large coefficient of thermal expansion and poor resistance to heat, moisture, oxygen, and chemicals shortens the lifetime of environmental sensitive electronic devices
Solution Approach 1:
The package structure employs composite materials including the flexible substrate, side wall barrier structure with multiple materials (adhesive layer, barrier layer, cover layer), and filler layer. These composite materials provide both the required flexibility for bending and the necessary barrier properties against moisture, oxygen, and chemicals, thereby extending device lifetime while maintaining adaptability.
Solution Approach 2:
The side wall barrier structure acts as an intermediary between the flexible substrate and the external environment. It provides the necessary protection against moisture, oxygen, and chemicals that the flexible substrate alone cannot prevent, thereby extending the lifetime of environmental sensitive electronic devices while preserving the bendability of the flexible substrate.
3Reliability
If the flexible substrate lacks complete barrier properties, then moisture infiltration and oxygen diffusion occur, but adding a side wall barrier structure increases device complexity
Solution Approach 1:
The side wall barrier structure is segmented into discrete portions along the bending direction with spacing between segments. This segmentation approach provides effective barrier protection while reducing the total amount of barrier material needed and simplifying the manufacturing process compared to a continuous barrier structure, thereby balancing protection effectiveness with device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively extends the lifespan of environmental sensitive electronic devices by maintaining moisture and oxygen barrier performance even when the device is bent, preventing deformation of the side wall barrier structures and ensuring continuous protection.
Implementation Method 1
the side wall barrier structure has at least one flexure stress dispersing structure. the flexure stress dispersing structure is located in the predetermined flexure area
Implementation Method 2
forming the barrier layers through etching and chemical vapor deposition
Data Source
AI summary
An environmental sensitive electronic device package includes a first substrate, a second substrate, an environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer. The first substrate has at least one predetermined flexure area. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate and between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate and surrounds the environmental sensitive electronic device. The side wall barrier structure has at least one flexure stress dispersing structure that is located in the predetermined flexure area. The filler layer is located between the first substrate and the second substrate and covers the side wall barrier structure and the environmental sensitive electronic device.