Side-Wrapped Display Traces for Compact Robust Signal Routing
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Solution Overview
Problem
Existing electronic devices with displays face challenges in providing robust and compact control signal connections to display pixels, often resulting in bulky and less robust components.
Innovation Solution
The use of side-wrapped conductive traces conformally wrapped around the display panel, interposed between insulating layers, to electrically connect contacts on the upper surface to a flexible printed circuit, along with a system-in-package including a display driver integrated circuit and redistribution layers, provides efficient and robust signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional control circuitry components are used to provide control signals to display pixels, then the connection function is achieved, but the components become bulky and less robust
Solution Approach 1:
The conductive traces are routed around the lateral edges of the display panel rather than through traditional planar connections, utilizing the third dimension (depth/thickness) to achieve compact signal routing. This edge-wrapping approach reduces the footprint while maintaining connection integrity
Solution Approach 2:
The conductive traces are embedded within nested insulating layers, with first conductive traces positioned between a first and second insulating layer, and second conductive traces positioned between a third and fourth insulating layer. This nested structure protects the conductive elements while minimizing overall volume
2Volume of moving object
If control circuitry is designed to be compact, then volume is reduced, but robustness during manufacturing and usage may be compromised
Solution Approach 1:
Multiple insulating layers are positioned around the conductive traces before final assembly, providing protective cushioning that prevents damage during manufacturing handling and usage. This preemptive protection ensures robustness while maintaining compact dimensions
Solution Approach 2:
The control circuitry employs composite structures combining conductive traces with multiple insulating layers, creating a composite material system that provides both electrical functionality and mechanical robustness in a compact package
3Productivity
If traditional signal routing methods are used, then manufacturing is simpler, but signal routing efficiency is reduced
Solution Approach 1:
The conductive traces are divided into distinct first and second subsets, with each subset routed through separate insulating layer pairs. This segmentation allows independent optimization of signal paths while maintaining overall routing efficiency
Solution Approach 2:
Conductive traces are routed in three-dimensional space around the display panel edges and through multiple insulating layers, utilizing vertical and lateral dimensions to achieve efficient signal routing without increasing planar footprint
Data Source
AI summary
Conductive traces may be conformally wrapped around the side of a display panel that includes an array of display pixels. The conductive traces may electrically connect contacts on an upper surface of the display panel to corresponding contacts on a flexible printed circuit that is attached to a lower surface of the display panel. The side-wrapped conductive traces may be interposed between first and second insulating layers. The flexible printed circuit may have a multi-step interface that is electrically connected to the side-wrapped conductive traces. A system-in-package including a display driver integrated circuit may be mounted to the flexible printed circuit. The system-in-package may include a plurality of redistribution layers that electrically connect contacts on the display driver integrated circuit to contacts on the flexible printed circuit.