Side-View LED Terminal Layout for Scrap-Free Electrical Isolation
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Solution Overview
Problem
In side-view type light emitting devices, the formation of resist layers on electrode terminals can lead to electrical conductivity issues due to the accumulation of cutting scrap during the dicing process, causing unintended connections between electrode terminals during plating treatment.
Innovation Solution
The resist layers covering the electrode terminals are designed to be separated by a distance in the X-axis direction, with specific width and thickness variations to prevent electrical conductivity, and the plating layer is formed to avoid extending beyond the resist surfaces, ensuring reliable electrical isolation between terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If resist layers are formed to cover electrode terminals during dicing, then manufacturing precision is improved, but cutting scrap accumulates causing electrical conductivity between terminals
Solution Approach 1:
The resist layer is divided into multiple separate resist portions, each covering a specific electrode terminal. The gaps between these segmented resist portions prevent cutting scrap from creating conductive paths between adjacent terminals, thus maintaining electrical isolation while still providing coverage protection during manufacturing
Solution Approach 2:
The resist layer configuration is optimized locally at each electrode terminal position. Each resist portion has specific width and positioning characteristics tailored to its corresponding terminal, ensuring adequate coverage while maintaining appropriate spacing from adjacent terminals to prevent scrap-induced conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents electrical conductivity between electrode terminals, enhancing the manufacturing process by reducing the risk of unwanted connections and improving the reliability of the light emitting device.
Implementation Method 1
a plating layer is formed on the surface of the electrode terminal that is not covered with the resist
Data Source
AI summary
A light emitting device comprising: a base material including a first main surface and a second main surface, and a first end portion and a second end portion; a light emitting element mounted on the first main surface of the base material and including a first electrode and a second electrode; a first electrode terminal and a second electrode terminal; a covering material; and a sealing material that seals the light emitting element, wherein the first electrode terminal is formed to extend in a first direction, wherein the second electrode terminal is formed to be separated from the first electrode terminal by a distance, wherein the covering material includes: a first covering material that partially covers the first electrode terminal; and a second covering material that partially covers the second electrode terminal, and wherein the first covering material and the second covering material are formed to be separated.