Signal Pad Insulation for Display Device Short Circuit Prevention
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Solution Overview
Problem
Existing display devices face challenges in effectively integrating an input sensing layer with signal pads to prevent short circuits and ensure reliable electrical connections while maintaining the structural integrity and display functionality.
Innovation Solution
The display device incorporates a specific configuration of signal pads with alternating first and second pad portions, where the second pad portion is exposed through a pad opening in the insulation layer, and an anisotropic conductive film connects these pads to the circuit board, preventing short circuits and ensuring reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal pads are directly exposed on the base layer for electrical connection, then electrical connection reliability is improved, but short circuit risk between adjacent pads increases
Solution Approach 1:
The patent introduces an insulation layer as an intermediary substance between adjacent signal pads. This insulation layer selectively covers portions of the signal pads, creating physical separation that prevents short circuits while allowing electrical connections to be made through exposed pad areas. The intermediary insulation layer resolves the contradiction by enabling both reliable electrical connection and short circuit prevention simultaneously.
Solution Approach 2:
The insulation layer is applied non-uniformly across the signal pad structure, with different regions having different coverage. Specifically, the insulation layer covers certain portions of adjacent signal pads to prevent short circuits, while leaving other portions exposed for electrical connections. This local differentiation of insulation coverage allows the system to achieve both isolation and connectivity requirements.
2Reliability
If an insulation layer is added to cover signal pads for preventing short circuits, then short circuit prevention is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the insulation layer formation process with existing manufacturing steps in the display device fabrication sequence. By integrating the insulation layer application into the overall manufacturing flow rather than treating it as a separate, additional process, the patent reduces the net increase in manufacturing complexity while achieving short circuit prevention.
3Area of stationary object
If signal pads are spaced closely for compact design, then area efficiency is improved, but short circuit risk between pads increases
Solution Approach 1:
The insulation layer serves as a mediator that enables close spacing of signal pads by providing electrical isolation between adjacent pads. This allows the design to achieve compact area utilization while maintaining adequate electrical separation through the insulating material positioned between the closely-spaced conductive pads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of electrical connections and prevents short circuits between signal pads, thereby improving the overall driving reliability and functionality of the display device.
Implementation Method 1
an anisotropic conductive film disposed between the signal pads and the connection pads, wherein the anisotropic conductive film electrically connects the second pad portion of each of the signal pads to the corresponding connection pad through the pad opening
Data Source
AI summary
A display device includes: a base layer including a display area and a non-display area; a circuit element layer disposed on the base layer; a display element layer disposed on the circuit element layer; a plurality of signal pads disposed on the base layer, wherein the plurality of signal pads are spaced a predetermined interval from each other, and are electrically connected to the circuit element layer; and an input sensing layer including a conductive layer and an input insulation layer, wherein the conductive layer is disposed on the display element layer, and the input insulation layer covers the conductive layer and a portion of each of the signal pads. Each of the signal pads includes a first pad portion and a second pad portion, wherein the first pad portion overlaps the input insulation layer, and the second pad portion does not overlap the input insulation layer.