Heterogeneous Integration of Silicon Microneedles and CMOS Circuitry
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Solution Overview
Problem
Current body-worn medical devices face challenges in miniaturization due to the integration of silicon-fabricated microneedles with CMOS circuitry, as existing methods result in large footprints and signal degradation, and are not scalable for unobtrusive, conformal, and flexible skin-adorned medical patches.
Innovation Solution
The method involves the heterogeneous and monolithic integration of semiconductor-based solid microneedle sensors and CMOS circuitry transducers using 3D packaging and interconnection techniques, such as stacked wire-bonding, reflow soldering, and through-silicon vias, to create self-contained sensing systems with reduced noise and increased miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete integration of microneedle sensors and CMOS circuitry is used, then ease of manufacture is improved, but device footprint increases
Solution Approach 1:
The patent merges microneedle sensor arrays and CMOS circuitry into a single integrated chip structure, eliminating the need for separate discrete components and interconnect traces. The microneedles are fabricated directly on the CMOS substrate using compatible processing steps, creating a unified device that reduces footprint while maintaining manufacturability through standardized semiconductor fabrication processes.
Solution Approach 2:
The patent transitions from planar (2D) discrete component arrangement to three-dimensional (3D) integration by vertically stacking microneedle arrays over CMOS circuit regions. This dimensional change allows multiple functional elements to occupy the same footprint area at different heights, significantly reducing the overall device area while preserving ease of manufacture through established 3D packaging techniques.
2Ease of manufacture
If conventional integration methods are used, then ease of manufacture is improved, but signal fidelity deteriorates
Solution Approach 1:
The patent introduces dedicated signal routing pathways and isolation structures as intermediaries between the microneedle sensing elements and CMOS readout circuits. These intermediaries include shielded conductive pathways and ground planes that prevent signal degradation and noise coupling, maintaining signal fidelity while using standard fabrication techniques to ensure ease of manufacture.
Solution Approach 2:
The patent applies local quality optimization by creating separate functional zones within the integrated chip - dedicated low-noise regions for signal generation, isolated regions for signal processing, and protected pathways for signal transmission. This spatial differentiation of functional qualities reduces cross-contamination of signals and maintains measurement precision while remaining manufacturable through localized process variations.
3Device complexity
If heterogeneous integration of microneedle sensors and CMOS circuitry is achieved, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the heterogeneous integration process into distinct fabrication modules - microneedle array formation, CMOS circuit patterning, and interconnection establishment - that can be manufactured using optimized processes for each component type. This segmentation allows each sub-process to achieve required precision independently while the overall device complexity is reduced through modular assembly, avoiding the need for monolithic precision across all heterogeneous elements.
Data Source
AI summary
A skin-adorned physiological or biochemical sensing device is disclosed herein. The device preferably comprises a first substrate and a second substrate. The first substrate comprises an array of solid microneedles designed to penetrate a biological interface to access a physiological fluid or tissue. Each microneedle is capable of electrical interface with the physiological fluid or tissue. The second substrate comprises integrated circuitry designed to transduce at least one signal produced by an electrophysiological or electrochemical reaction. A sensing device is formed that is capable of interpreting the signal arising from the electrophysiological or electrochemical reaction to ascertain the level of some physiological or biochemical entity.