Silicon-Supported Photonic Chip Structure for Low-Loss Packaging
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Solution Overview
Problem
Semiconductor packages are required to be highly integrated and compact while supporting multifunctionality, particularly with the increasing data traffic in data centers and communication infrastructures, and existing technologies face challenges in efficiently integrating photonic integrated circuits.
Innovation Solution
A chip structure is designed with a photonic integrated circuit chip, an electronic integrated circuit chip, a silicon block, and a silicon support featuring a micro lens, all made of the same material, and a semiconductor package that includes an interposer substrate connecting these components, allowing for efficient optical signal communication and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photonic integrated circuits are integrated into semiconductor packages to support increasing data traffic, then data transmission capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines photonic integrated circuit chip, electronic integrated circuit chip, silicon block, and micro lens into a single integrated chip structure that is mounted on the package substrate. This merging of multiple functional components into one unified structure improves data transmission capability while managing device complexity through integrated design rather than separate components.
Solution Approach 2:
The chip structure serves multiple functions simultaneously: the photonic integrated circuit chip handles optical signal transmission, the electronic integrated circuit chip provides electronic processing, the silicon block offers structural support and alignment, and the micro lens focuses optical signals. This multi-functionality within a single chip structure addresses increasing data traffic requirements without proportionally increasing device complexity.
2Area of stationary object
If multiple components are integrated into a compact semiconductor package, then package size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent applies different material properties to different parts of the chip structure to address local heat dissipation needs. The silicon block and silicon support provide thermal conduction pathways, while the photonic and electronic circuit chips are positioned to utilize these thermal pathways. This local differentiation of material properties enables effective heat dissipation within the compact package structure.
3Productivity
If optical components are integrated closely with electronic components, then optical signal conversion efficiency is improved, but optical loss increases due to material mismatches
Solution Approach 1:
The patent uses silicon material for both the silicon block and silicon support, ensuring material homogeneity and matching refractive indices. This homogeneity reduces optical loss at interfaces between components while maintaining close integration for efficient optical signal conversion. The consistent silicon material throughout the optical path minimizes reflection and scattering losses.
4Productivity
If precise alignment of optical components is achieved, then optical signal transmission is improved, but manufacturing precision requirements increase
Solution Approach 1:
The silicon block is designed with predetermined dimensions and positioning features that enable pre-alignment of the photonic integrated circuit chip and micro lens. This preliminary structuring of the silicon block provides reference surfaces and mechanical constraints that facilitate precise alignment during assembly, reducing the actual manufacturing precision requirements while maintaining optimal optical signal transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high integration and efficient optical signal conversion with reduced optical loss and improved heat dissipation, enhancing the performance of semiconductor packages in compact electronic devices.
Implementation Method 1
a silicon support on an upper surface of the electronic integrated circuit chip, an upper surface of the silicon block, and an upper surface of the first insulating layer, where the silicon support includes a micro lens
Data Source
AI summary
A chip structure includes a photonic integrated circuit chip including a waveguide extending in a horizontal direction, an electronic integrated circuit chip on the photonic integrated circuit chip, a silicon block above the photonic integrated circuit chip in a vertical direction and spaced from the electronic integrated circuit chip in the horizontal direction, a first insulating layer at least partially surrounding the electronic integrated circuit chip and the silicon block, and a silicon support on an upper surface of the electronic integrated circuit chip, an upper surface of the silicon block, and an upper surface of the first insulating layer, where the silicon support includes a micro lens, the micro lens is below an upper surface of the silicon support, and the silicon block includes a material that is the same as a material of the silicon support.