Silicon Waveguide NTE Trench for Thermal Stability

Solution Overview

Problem

Integrated silicon photonics devices, such as micro-rings, are sensitive to temperature changes, leading to inefficiencies in energy use due to the need for heaters and additional control circuits to maintain performance, which conflicts with the goal of reducing energy dissipation per bit in data transfer.

Innovation Solution

Incorporating a localized region of negative thermal expansion (NTE) coefficient material within a trench or as a cladding layer surrounding photonics or CMOS components to mitigate the effects of temperature changes, reducing the need for heaters and control circuits by using materials like graphene or complex oxide nano-crystals mixed with host materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If heaters are built into the integrated photonics stack to control component temperature, then temperature stability is improved, but energy dissipation increases and device complexity increases

Engineering Contradiction:

Improvetemperature stabilityVSAvoidenergy dissipation

Core Design Contradiction:

Stability of the object's compositionVSUse of energy by moving object

Solution Approach 1:

The patent converts the harmful thermal expansion effect into a beneficial compensation mechanism by introducing NTE materials that contract when heated, thereby compensating for the expansion of Si photonics components and eliminating the need for energy-consuming heaters

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent applies the principle of thermal expansion by selecting materials with negative thermal expansion coefficients that contract in response to temperature increases, counterbalancing the positive thermal expansion of silicon photonics components and maintaining dimensional stability without active heating

Inventive Principle:

Principle #37Thermal expansion

2Stability of the object's composition

If heaters are built into the integrated photonics stack to control component temperature, then temperature stability is improved, but device complexity increases

Engineering Contradiction:

Improvetemperature stabilityVSAvoiddevice complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent converts the harmful thermal expansion effect into a beneficial compensation mechanism by introducing NTE materials that contract when heated, thereby compensating for the expansion of Si photonics components and eliminating the need for energy-consuming heaters

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent applies the principle of thermal expansion by selecting materials with negative thermal expansion coefficients that contract in response to temperature increases, counterbalancing the positive thermal expansion of silicon photonics components and maintaining dimensional stability without active heating

Inventive Principle:

Principle #37Thermal expansion

3Stability of the object's composition

If additional process steps are added to form heaters and control circuits, then temperature control capability is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvetemperature control capabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent merges the NTE material formation with existing trench isolation processes in Si photonics manufacturing, allowing temperature compensation to be achieved without adding separate heater fabrication steps or control circuit integration

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent converts the harmful thermal expansion effect into a beneficial compensation mechanism by introducing NTE materials that contract when heated, thereby compensating for the expansion of Si photonics components and eliminating the need for energy-consuming heaters

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces energy dissipation per bit by minimizing the impact of temperature changes on component performance, ensuring that micro-rings remain tuned to the desired wavelength, thereby enhancing the efficiency of data transfer while reducing the complexity and energy consumption of integrated photonics systems.

Implementation Method 1

a localized region of negative thermal expansion (NTE) coefficient material formed within a trench

Methodology Applied

Scientific EffectNegative thermal expansion: Negative Thermal Expansion

Data Source

PatentUS9864132B1Silicon waveguide devices in integrated photonics

Publication Date: 2018.01.09 GLOBALFOUNDRIES US INC

AI summary

The present disclosure relates to semiconductor structures and, more particularly, to silicon waveguide devices in integrated photonics and methods of manufacture. The integrated photonics structure includes: a localized region of negative thermal expansion (NTE) coefficient material formed within a trench; at least one photonics or CMOS component contacting with the negative thermal expansion (NTE) coefficient material; and cladding material formed above the at least one photonics or CMOS component.