Silicon X-Ray Detector Module With CMOS Photon-Counting Readout
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Solution Overview
Problem
Conventional mammography systems are slow in read-out speed and can only be used for integrating detectors, resulting in 'grey' value detection of X-ray energy, and they often employ toxic materials like CdTe or CdZnTe, which are hazardous and costly.
Innovation Solution
A silicon-based X-ray detector module with a CMOS read-out circuit chip, using hybrid bonding or solder connections, that enables energy-resolved mammography by directly converting X-ray photons to electrical charge, reducing false-positive findings and improving diagnostic accuracy at lower costs compared to conventional systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional scintillator-based or direct detection systems are used, then X-ray detection is achieved, but read-out speed is slow (microsecond range) and only integrating detection is possible
Solution Approach 1:
The patent combines a silicon sensor chip with a CMOS read-out circuit chip into a single integrated detector component. The silicon sensor chip detects X-ray photons and generates electrical signals, which are then read out by the integrated CMOS circuit. This merging eliminates the bottleneck of separate read-out systems and enables high-speed photon counting detection with energy resolution capability.
Solution Approach 2:
The patent changes the detection parameter from integrating detection (measuring total energy over time) to photon counting detection (measuring individual photon events). By using silicon sensor chips with embedded charge collecting electrodes and CMOS read-out circuits, the system can detect and count individual X-ray photons with energy resolution, achieving microsecond-range read-out speeds while maintaining detection reliability.
2Reliability
If toxic materials like CdTe or CdZnTe are used in conventional detectors, then detection performance is achieved, but health hazards and manufacturing costs increase
Solution Approach 1:
The patent replaces expensive and toxic materials (CdTe, CdZnTe) with silicon, which is non-toxic, abundant, and compatible with standard CMOS manufacturing. The silicon sensor chip can be manufactured using established semiconductor processes, making the detector component cheaper and safer while maintaining detection performance through the direct conversion of X-ray photons to electrical signals.
Solution Approach 2:
The patent changes the material parameter from toxic high-Z materials to non-toxic silicon. By utilizing silicon's semiconductor properties and its ability to generate electron-hole pairs upon X-ray absorption, the system achieves detection performance comparable to or better than toxic materials, while eliminating health hazards and reducing manufacturing costs through CMOS compatibility.
3Ease of manufacture
If wafer-based silicon sensor chips are used, then non-toxic materials and scalable manufacturing are achieved, but integration with read-out circuits becomes complex
Solution Approach 1:
The patent merges the silicon sensor chip and CMOS read-out circuit chip into a single integrated component through direct bonding. The sensor chip and read-out circuit chip are bonded together with matching surface areas, creating a compact integrated detector component. This merging simplifies the overall system architecture and enables scalable manufacturing through standard semiconductor bonding processes.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking by bonding the sensor chip to the read-out circuit chip. This vertical integration approach allows both chips to maintain their full surface area while achieving compact integration, simplifying the manufacturing process and enabling scalable production through established semiconductor bonding techniques.
4Measurement precision
If photon counting detection is implemented, then energy resolution is achieved, but false-positive findings are reduced requiring more sophisticated detection algorithms
Solution Approach 1:
The patent replaces complex mechanical or optical energy resolution systems with electronic photon counting detection. By using silicon sensor chips that directly convert X-ray photons to electrical signals with energy-proportional amplitudes, the system achieves energy resolution through electronic signal processing rather than mechanical or optical methods. This substitution reduces false-positive findings while maintaining manageable processing complexity through standard CMOS circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicon-based X-ray detector module allows for energy-resolved mammography with reduced false-positive findings and improved diagnostic accuracy, using non-toxic materials and scalable CMOS technology, while being more cost-effective than photon counting computer tomography systems.
Implementation Method 1
X-ray radiation is transferred to a current by the photoelectric effect
Implementation Method 2
a scintillator, which transfers X-ray radiation to light and which is arranged on amorphous silicon
Implementation Method 3
detection of X-ray radiation through a phosphorescent screen, which is read out through a laser beam later on
Data Source
AI summary
The invention relates to an X-ray detector component including an X-ray detector chip made from a silicon substrate and comprising charge collecting electrodes. The X-ray detector chip is suitable for providing an X-ray-dependent current at the charge collecting electrodes. The X-ray detector component further includes a CMOS read-out circuit chip including connection electrodes. The X-ray detector chip and the CMOS read-out circuit chip are mechanically and electrically connected in such a manner that the charge collecting electrodes and the connection electrodes are electrically connected. The invention further relates to an X-ray detection module, an imaging device and a method for manufacturing an X-ray detector component.