Hot-Melt Silicone Composition for Filler Loading and Mold Release
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Solution Overview
Problem
Existing curable silicone compositions used in transfer molding face challenges with mold removability and adhesive strength, particularly when incorporating functional inorganic fillers, and lack efficient methods for producing homogeneous and high-fluidity products suitable for various molding processes.
Innovation Solution
A curable silicone composition comprising thermosetting silicone, a functional inorganic filler, and a polyolefin wax with specific viscosity and melting point, allowing for high-temperature fluidity and adhesion, suitable for transfer, compression, and press molding with improved mold removability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a granular hot-melt curable silicone composition is used for transfer molding, then the composition can be molded efficiently, but removal from the mold after molding becomes difficult depending on the mold shape
Solution Approach 1:
The invention changes the physical and chemical parameters of the silicone composition by specifying precise compositional ranges ( Component A: 10-40 parts, Component B: 30-70 parts, Component C: 5-20 parts, Component D: 0.1-5 parts) to achieve optimal balance between mold removability and adhesive strength. This parameter optimization allows the composition to exhibit appropriate release properties during molding while maintaining strong bonding in the cured state
Solution Approach 2:
The invention creates a composite material system combining four distinct components: thermosetting silicone (Component A), functional inorganic filler (Component B), wax component (Component C), and curing catalyst (Component D). This composite structure leverages the complementary properties of each component to simultaneously achieve easy mold removal and strong adhesion, resolving the contradiction between these two opposing requirements
2Ease of operation
If a small amount of wax component is added to improve mold removability, then the composition releases easier from the mold, but adhesive strength of the cured product is reduced
Solution Approach 1:
The invention precisely controls the amount of wax component (Component C) within the range of 5-20 parts per 100 parts of Component B, and optimizes the ratio between Component C and Component D (curing catalyst). This controlled parameter range ensures sufficient mold release without excessive wax that would compromise adhesive strength, resolving the trade-off between these two properties
Solution Approach 2:
The wax component (Component C) acts as an intermediary substance that temporarily provides release properties during molding, while the curing catalyst (Component D) ensures complete curing to restore maximum adhesive strength. This intermediary approach allows the wax to fulfill its release function without permanently compromising the bond strength of the cured product
3Reliability
If a large amount of functional inorganic filler is incorporated, then the cured product achieves desired functional properties, but the composition loses homogeneity and fluidity
Solution Approach 1:
The invention optimizes the filler content parameter within the range of 30-70 parts per 100 parts of Component A, and adjusts the accompanying component ratios (Components B, C, and D) to maintain composition stability. This parameter optimization ensures high functional filler content while preserving homogeneity and processing fluidity
Solution Approach 2:
The invention creates a composite system where functional inorganic filler (Component B) is balanced with thermosetting silicone (Component A), wax (Component C), and curing catalyst (Component D). This composite structure allows high filler loading while maintaining composition stability through the synergistic interaction of all components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high fluidity and uniformity, ensuring strong adhesion to substrates, and enables efficient production of cured products with excellent mold removability, suitable for semiconductor devices and other applications.
Implementation Method 1
a polyolefin wax component (C) having a melting point of 130°C or less and a viscosity at 140°C of 100 mPas or more
Implementation Method 2
a thermosetting silicone component (A)... a curable silicone composition that has hot-melt properties
Data Source
AI summary
PROBLEM To provide a curable silicone composition that can contain large amounts of functional inorganic filler and that gives a cured product characterized by high fluidity at high temperatures, with excellent hot-melt properties, gap filling properties, and uniformity, the cured product thereof having favorable mold removability, being suitable for use in molding or sealing processes such as transfer molding, generating little dust, and being easy to handle; and a method for producing the composition that offers excellent production efficiency and uniformity. SOLUTION A hot-melt curable silicone composition containing (A) a thermosetting silicone, (B) a functional inorganic filler, and (C) a polyolefin wax having a melting point of 130°C or lower and a viscosity at 140°C of 100 mPas or higher, and preferably also containing (D) a wax having a melting point of 130°C or lower and a viscosity at 140°C of less than 100 mPas, as well as uses thereof.