Silicone Gel Composition for High-Temperature Power Module Insulation
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Solution Overview
Problem
Existing silicone gels used in power modules deteriorate under high temperatures, leading to peeling from substrates, generation of air bubbles, and loss of electrical insulation, which compromises the reliability of power semiconductor modules.
Innovation Solution
A silicone gel composition containing an isocyanuric acid derivative with specific trialkoxysilyl groups, alkoxysilyl acetal compounds, and a reaction product of organopolysiloxane and cerium carboxylate, which when cured, provides a product with high penetration, excellent adhesion, and maintains low elastic modulus and stress, preventing peeling and bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional silicone gel is used in power modules, then it provides basic insulation and protection, but it hardens and deteriorates at high temperatures exceeding 150°C, causing cracks and peeling from constituent members
Solution Approach 1:
The patent changes the chemical composition parameters of silicone gel by incorporating specific heat-resistant compounds and additives, transforming the material's thermal stability characteristics to maintain flexibility and adhesion at temperatures exceeding 150°C without hardening or deteriorating
Solution Approach 2:
The patent creates a composite silicone gel material by combining conventional silicone base with heat-resistant additives and stabilizing compounds, resulting in a multi-component system that provides both insulation properties and high-temperature stability, preventing cracks and peeling
2Temperature
If fillers such as iron oxide and titanium oxide are added to improve heat resistance, then heat resistance is enhanced, but insulation deteriorates, sedimentation occurs, and viscosity increases
Solution Approach 1:
The patent changes the thermal protection mechanism by using organic heat-resistant compounds and stabilizers instead of inorganic fillers, maintaining electrical insulation properties while achieving heat resistance through chemical stabilization rather than physical filler addition
Solution Approach 2:
The patent replaces expensive and problematic inorganic filler materials with more effective organic heat-resistant compounds that provide the same thermal protection without the negative side effects of sedimentation and insulation deterioration
3Stress or pressure
If penetration of sealed silicone gel is increased to alleviate stress on bonding wires, then stress is reduced, but bubbles are generated in the silicone gel or at the interface with the substrate at high temperatures
Solution Approach 1:
The patent changes the viscoelastic parameters of silicone gel by adjusting its composition and cross-linking structure, enabling the material to maintain optimal penetration and stress distribution while preventing bubble formation through improved thermal stability and controlled flexibility at high temperatures
4Strength
If adhesion-imparting agents such as silane coupling agents are added to suppress peeling from the semiconductor substrate, then adhesion is improved, but peeling still occurs over time during heating or electrical insulation deteriorates in high temperature and humidity
Solution Approach 1:
The patent creates a composite adhesion system by combining silane coupling agents with heat-resistant stabilizing compounds, resulting in a multi-functional material that provides both strong initial adhesion and long-term stability during thermal cycling and humid conditions
Solution Approach 2:
The patent changes the chemical stability parameters of adhesion promoters by using heat-resistant compounds that maintain their adhesion-imparting properties at elevated temperatures, preventing the degradation and peeling that occurs with conventional adhesion agents over time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicone gel composition ensures long-term reliability of power semiconductor modules by maintaining adhesion and electrical insulation at high temperatures, preventing peeling and bubble generation, and retaining low elastic modulus and stress.
Implementation Method 1
an isocyanuric acid derivative having a specific structure and having at least two trialkoxysilyl groups as an adhesion-imparting agent
Implementation Method 2
at least two trialkoxysilyl groups as an adhesion-imparting agent
Implementation Method 3
alkoxysilyl acetal compounds having the following general formula (3) and/or a partial hydrolytic condensate thereof
Implementation Method 4
a specific heat resistance improver composed of a reaction product of an organopolysiloxane and a carboxylate of cerium
Implementation Method 5
unsuitable as a silicone gel material for an IGBT power module that requires low viscosity and insulation
Data Source
AI summary
This silicone gel composition contains (A) an organopolysiloxane having one or more silicon atom-bonded alkenyl groups per molecule, (B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule, (C) a platinum group metal-based curing catalyst, (D) an isocyanuric acid derivative having two trialkoxysilyl groups and one crosslinkable vinyl group and/or an isocyanuric acid derivative having three trialkoxysilyl groups, and (E) a ketenesilylacetal-type compound, and provides a cured product having a specific penetration. The silicone gel composition can provide a silicone gel cured product that is a silicone gel having excellent heat resistance and adhesiveness to metals at high temperature and having a high penetration, that is capable of maintaining a low elastic modulus and a low stress even in use at high temperature for long periods of time, and that enables reduction of the occurrence of bubbles and reduction of deterioration in releasability from a substrate and in electrical insulating properties.