Silicone-Modified Epoxy Resin Composition for Semiconductor Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor encapsulant resins face challenges in achieving high tracking resistance while maintaining flow and heat resistance, especially with the miniaturization of semiconductor devices, where the reduced spacing between interconnects and lead terminals complicates electric insulation and increases the risk of conductive path formation.
Innovation Solution
A silicone-modified epoxy resin composition comprising a specific silicone-modified epoxy resin, silicone-modified phenolic resin, black pigment, and inorganic filler, which are combined to enhance tracking resistance and suppress the formation of conductive paths that can cause short-circuiting, while maintaining flow and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amount of inorganic filler is increased to enhance tracking resistance, then tracking resistance is improved, but flow during molding deteriorates
Solution Approach 1:
The invention uses a composite resin system combining aromatic epoxy resin, non-aromatic epoxy resin, and phenolic resin in specific ratios. This composite approach allows the material to achieve high tracking resistance through the aromatic component while the non-aromatic component and phenolic resin maintain flow properties, resolving the contradiction between tracking resistance and moldability
Solution Approach 2:
The invention specifies precise compositional parameters: aromatic epoxy resin 40-80 parts, non-aromatic epoxy resin 10-50 parts, and phenolic resin 5-20 parts per 100 parts of total epoxy resin. By controlling these parameter ranges, the formulation achieves optimal balance between tracking resistance (improved by aromatic content) and flow characteristics (maintained by non-aromatic and phenolic components)
2Ease of manufacture
If non-aromatic epoxy resin is used to improve flow, then flow during molding is improved, but heat resistance deteriorates
Solution Approach 1:
The invention creates a composite resin system where aromatic epoxy resin (providing heat resistance) and non-aromatic epoxy resin (providing flow) are combined in specific proportions. The phenolic resin further modifies the system to balance these properties, allowing simultaneous achievement of high flow and heat resistance that neither component alone can provide
Solution Approach 2:
The invention controls the ratio of aromatic to non-aromatic epoxy resin within specific ranges (aromatic: 40-80 parts, non-aromatic: 10-50 parts per 100 parts total epoxy). This parameter optimization ensures sufficient aromatic content for heat resistance while maintaining enough non-aromatic content for flow, resolving the temperature-flow contradiction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively improves tracking resistance and minimizes the formation of conductive paths, ensuring reliable semiconductor device encapsulation with enhanced heat resistance and flow properties.
Implementation Method 1
a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane
Implementation Method 2
a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane
Data Source
AI summary
The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.