Silicone Resin Composition for Stable Thermal Conductivity in Semiconductors
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Solution Overview
Problem
Existing thermally conductive materials in semiconductor devices exhibit variations in hardness, leading to inconsistent thermal conductivity characteristics and reduced reliability of product performance.
Innovation Solution
A silicone-based resin composition with a specific formulation that minimizes thermal conductivity variation and maintains excellent mechanical properties, using organic polysiloxane and conductive fillers with controlled particle size and shape, ensuring a relative ratio of thermal conductivity change to Shore A hardness change of 40% or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional organic resin is used for filling spaces in a semiconductor package, then the manufacturing process is simple, but the resin shrinks during curing causing voids and poor filler distribution
Solution Approach 1:
The patent uses a composite resin system combining silicone base resin with epoxy resin and phosphazene fire retardant to achieve both good filler distribution and desired properties. The silicone resin component specifically addresses the shrinkage issue while maintaining compatibility with the overall resin system
Solution Approach 2:
The patent modifies the chemical composition parameters of the resin by incorporating specific components (silicone resin, phosphazene fire retardant) to change the curing behavior and reduce shrinkage. This allows the resin to maintain volume stability while still achieving proper filler distribution
2Duration of action of stationary object
If the resin shrinks during curing, then the curing process is complete, but voids form between the lead frame and filler particles
Solution Approach 1:
The patent incorporates a silicone resin component that acts as a cushioning agent during curing, compensating for volume reduction and preventing void formation. This preemptive measure ensures that the resin maintains adequate volume to fill all spaces between lead frame and filler particles throughout the curing process
3Object-affected harmful factors
If fire retardant is added to the resin, then flame propagation is inhibited, but the resin composition becomes more complex
Solution Approach 1:
The patent uses phosphazene as an intermediary fire retardant component that integrates well with the resin system. This mediator provides flame propagation inhibition while maintaining compatibility with the silicone and epoxy resin components, avoiding excessive complexity in the overall composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves stable thermal conductivity and improved reliability by reducing thermal conductivity variation, enhancing adhesion and moldability, even with a low conductive filler content, thus maintaining effective heat dissipation and product performance.
Implementation Method 1
phosphazene fire retardant having a weight average molecular weight of 1,000 to 10,000 and a phosphorus content of 9 wt % to 70 wt %
Implementation Method 2
capable of inhibiting flame propagation
Implementation Method 3
silicone base resin and epoxy resin in a weight ratio of 95/5 to 40/60
Data Source
Figure 1(a)~1(e)
Figure 2
AI summary
Disclosed are a silicone-based resin composition including an organic polysiloxane and a conductive filler; and a semiconductor device including the silicone-based resin composition, wherein a relative ratio of a change in thermal conductivity to a change in Shore A hardness, measured by a measurement method below, of the silicone-based resin composition is 40% or less: [Measurement method](see the description of the invention)