Silver-Copper-Silver Sandwich Structure for High Frequency Signal Transmission
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Solution Overview
Problem
Copper conductive wire layers experience significant signal losses when transmitting high frequency signals due to the conductive skin effect, which reduces transmission efficiency.
Innovation Solution
A high frequency signal transmission structure is developed using an insulating sheet with a silver conductive layer, a copper conductive layer sandwiched between the silver layers, and a silver covering layer, where the silver layers enclose the copper layer to minimize signal loss by leveraging silver's higher electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If copper conductive wire layer is used for manufacturing, then manufacturing cost and ease of manufacture are improved, but signal loss increases at high frequency
Solution Approach 1:
The patent applies composite materials by combining copper conductive layer with silver plating layer to create a hybrid structure that leverages the manufacturing advantages of copper (ease of manufacture, cost-effectiveness) while incorporating silver's superior electrical conductivity to reduce high-frequency signal loss. The silver layer is applied as a coating on the copper substrate, creating a composite conductive structure that optimizes both manufacturing ease and electrical performance.
2Loss of energy
If silver conductive layer is used instead of copper, then signal loss is reduced due to higher electrical conductivity, but manufacturing cost increases
Solution Approach 1:
The patent applies local quality by selectively applying silver plating only to the surfaces and critical regions where high-frequency signal transmission occurs, rather than using solid silver throughout. This localized application of silver ensures that the areas most critical for reducing signal loss (the conductive surfaces exposed to the signal) have the superior electrical conductivity of silver, while the bulk material remains as cost-effective copper.
3Device complexity
If copper is used for high frequency signal transmission, then manufacturing simplicity is maintained, but transmission efficiency deteriorates due to conductive skin effect
Solution Approach 1:
The patent applies the extraction principle by taking out the problematic property of copper (high electrical resistance at high frequencies due to skin effect) and replacing it with silver's superior conductivity at the critical surface regions where the high-frequency signal currently flows. This extraction of the problematic characteristic from the bulk material and its replacement at the surface level resolves the transmission efficiency issue while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure reduces transmission losses and enhances the efficiency of high frequency signal transmission by distributing current on the surface of the silver layers, thereby improving signal integrity and efficiency.
Implementation Method 1
large signal losses occur when the copper conductive wire layer is used to transmit a high frequency signal
Data Source
AI summary
A method for fabricating a sandwiched structure of silver-copper-silver functioning as a high frequency signal transmission structure includes an insulating sheet and a conductive circuit on the insulating sheet. The conductive circuit includes a silver conductive layer bonded to the insulating sheet, a copper conductive layer formed on the silver conductive layer, and a silver covering layer laid to cover top and side surfaces of the copper conductive layer. The silver conductive layer and the silver covering layer together enclose the copper conductive layer and the higher conductivity of the silver together with the skin effect improves high-frequency transmission efficiency of the copper.