Silver Etching Composition Preventing Ion Adsorption

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Solution Overview

Problem

Silver-containing thin films in organic light-emitting display devices are prone to defects due to silver ions dissolving in etching compositions and adsorbing onto other metal patterns, leading to reductive precipitation and manufacturing failures.

Innovation Solution

An etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, and an amino acid compound, specifically formulated to selectively etch silver-containing thin films while preventing silver particle formation and damage to adjacent metal layers, ensuring controlled etching rates and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional etching composition is used to etch silver-containing thin film, then etching process can be performed, but silver ions dissolve and adsorb onto other metal patterns causing defects

Engineering Contradiction:
Improveetching precisionVSAvoidsilver particle formation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a complexing agent as an intermediary substance that binds to silver ions, preventing them from adsorbing onto other metal patterns. The complexing agent acts as a mediator between the etching composition and silver ions, controlling their interaction to avoid harmful silver particle formation while maintaining effective etching

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the chemical parameters of the etching composition by adjusting the types and concentrations of acids (nitric acid, acetic acid), complexing agents (EDTA, citric acid), and oxidizing agents. These parameter changes optimize the etching process to prevent silver ion dissolution and adsorption while maintaining etching effectiveness

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If etching composition etches silver-containing thin film, then pattern can be formed, but other metal layers may be damaged

Engineering Contradiction:
Improvepattern formation accuracyVSAvoiddamage to adjacent metal layers
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The etching composition is designed with selective chemical properties that create local quality differences in its reactivity. Different components of the composition interact differently with various metal layers, allowing selective etching of the silver-containing thin film while leaving other metal layers intact through controlled chemical affinity

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent optimizes the chemical composition parameters including acid concentration, complexing agent ratio, and oxidizing agent strength to achieve selective etching. By carefully controlling these parameters, the etching process targets specific silver-containing layers while preserving other metal layers with different chemical resistance characteristics

Inventive Principle:
Principle #35Parameter changes

3Productivity

If conventional etching is performed on silver-containing thin film, then etching can proceed, but reductive precipitation occurs causing manufacturing failures

Engineering Contradiction:
Improveetching rateVSAvoidmanufacturing process reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The complexing agent serves as an intermediary that stabilizes silver ions in solution through chelation, preventing reductive precipitation. This mediator maintains silver ions in a soluble state throughout the etching process, ensuring reliable manufacturing without precipitation-related failures while maintaining productive etching rates

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent adjusts chemical parameters including pH control, oxidizing agent concentration, and complexing agent dosage to prevent reductive precipitation. These parameter optimizations ensure that silver ions remain stable in solution during etching, maintaining both high productivity and manufacturing reliability

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The etching composition achieves selective etching of silver-containing thin films, reduces defects in manufacturing processes, and enhances the reliability of display devices by preventing silver residue and re-adsorption, while maintaining appropriate CD-skew and etching stability over time.

Implementation Method 1

silver ions may be dissolved in the etching composition

Methodology Applied
Scientific EffectChemical dissolution: Solvation

Implementation Method 2

a metal oxidizing agent

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS12031076B2Etching composition for thin film containing silver, method for forming pattern and method for manufacturing a display device using the same
Publication Date: 2024.07.09 SAMSUNG DISPLAY CO LTD
  • US12031076B2 patent drawing
  • US12031076B2 patent drawing
  • US12031076B2 patent drawing

AI summary

An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.