Etching Solution for Silver-ITO Reflective Electrodes

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for forming reflective electrodes in display panels often result in damage to the edge of the silver layer and residue formation, which degrade the reflection effect and display quality.

Innovation Solution

A one-step etching process using an etching solution composed of 1 to 2.6 wt % nitric acid, 35 to 45 wt % acetic acid, and 35 to 45 wt % phosphoric acid, along with water, is applied to a conductive layer stack containing indium-containing oxide and silver or silver alloy layers, to form patterned sub-layers without damaging the silver layer edges and reducing residues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional etching methods are used to form reflective electrodes, then the etching process can remove material, but the edge of the silver layer is damaged and residues are formed

Engineering Contradiction:
Improveedge quality of silver layerVSAvoidedge damage and residue formation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by optimizing the etching solution composition (specific ratios of nitric acid, acetic acid, and phosphoric acid) and etching conditions (temperature, time) to achieve selective etching that removes material without damaging the silver layer edges or forming residues

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses an intermediary etching solution with specific chemical properties that mediates between the etching requirement (material removal) and the protection requirement (preserving silver layer edges). The solution contains multiple acids working together to provide controlled etching without the harmful effects of conventional single-acid solutions

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If multiple-step etching processes are used to improve precision, then better control is achieved, but the process complexity and time increase

Engineering Contradiction:
Improveetching control precisionVSAvoidetching process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple etching functions into a single etching solution that can selectively etch different materials (ITO and silver) with appropriate control. This combined approach achieves the precision of multi-step processes while simplifying the overall process into one step, reducing complexity and production time

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The etching process effectively suppresses edge damage and residue formation, enhancing the reflection effect and overall display quality by improving the uniformity and flatness of the reflective electrodes.

Implementation Method 1

performing an etching process on the conductive layer stack, an etching solution is used in the etching process to etch the first sub-layer, the second sub-layer and the third sub-layer

Methodology Applied
Scientific EffectChemical etching: Oxidation

Data Source

PatentUS20240172475A1Etching solution and manufacturing method of display panel
Publication Date: 2024.05.23 HANNSTAR DISPLAY CORP
  • US20240172475A1 patent drawing
  • US20240172475A1 patent drawing
  • US20240172475A1 patent drawing

AI summary

The invention discloses an etching solution and a manufacturing method of a display panel. The method includes following steps: providing a first substrate; forming a conductive layer stack including a first sub-layer, a second sub-layer and a third sub-layer, each of the first sub-layer and the second sub-layer includes a transparent conductive material including indium-containing oxide, the third sub-layer is disposed between the first sub-layer and the second sub-layer, and the third sub-layer includes silver or silver alloy; performing an etching process, an etching solution is used to etch the first sub-layer, the second sub-layer and the third sub-layer to form a first patterned sub-layer, a second patterned sub-layer and a third patterned sub-layer, and the etching solution includes 1 to 2.6 wt % of nitric acid, 35 to 45 wt % of acetic acid, 35 to 45 wt % of phosphoric acid and a remaining amount of water.