Silver-Palladium Electrode for Thermal Print Head Cost Reduction
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Solution Overview
Problem
The high manufacturing cost of thermal print heads is due to the use of gold (Au) as the main component in the electrode layer, which is expensive, and existing solutions have not effectively reduced this cost while maintaining the necessary electrical properties and bonding requirements.
Innovation Solution
A manufacturing method for a fine wiring pattern using thick-film printing with a support member, forming layers of silver (Ag) and palladium (Pd) to create a suitable electrode layer with a silver-palladium alloy, where the first layer is thinner and has a higher palladium content than the second layer, and the second layer includes silver particles and glass, allowing for precise etching to achieve a fine wiring pattern with reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Au is used as the main component of the electrode layer, then the electrode layer can be suitably supported on a substrate, resistance is reduced, and bonding is improved, but the manufacturing cost increases
Solution Approach 1:
The patent replaces expensive gold (Au) with cheaper silver (Ag) as the main component of the electrode layer. This substitution directly addresses the cost issue while maintaining the necessary electrical and mechanical properties through optimized paste composition and thick-film printing processes
Solution Approach 2:
The patent uses composite paste materials containing silver particles, glass frit, and organic vehicles in specific ratios. The multi-layer structure with different Ag ratios (first layer ≤80% Ag, second layer ≥80% Ag) creates a composite material system that achieves both cost reduction and performance requirements
2Adaptability or versatility
If a fine wiring pattern with small spacing is formed, then the device functionality is improved, but the manufacturing precision requirement increases
Solution Approach 1:
The patent optimizes multiple parameters including paste composition (Ag ratio, glass frit type), layer thickness (first layer thinner than second layer), sintering temperature, and printing conditions to achieve reliable formation of fine wiring patterns with 25 μm or smaller wiring width and 40 μm or smaller spacing
Solution Approach 2:
The patent transitions from planar patterning to three-dimensional multi-layer construction, where the first and second layers are formed at different heights/thicknesses. This vertical dimension provides manufacturing tolerance compensation and improves pattern definition for fine features
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces the manufacturing cost of thermal print heads by using silver instead of gold, enhances the contact area and bonding strength with the resistor layer, and maintains precise patterning capabilities, achieving a low sheet resistance and reliable electrical conductivity.
Implementation Method 1
forming a first layer on the support member by thick-film printing; forming a second layer including Ag on the first layer by the thick-film printing
Implementation Method 2
forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer
Implementation Method 3
the second layer includes Ag particles; the second layer includes a glass
Data Source
AI summary
According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.