Silylating Surface Treatment for Semiconductor Pattern Collapse
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Solution Overview
Problem
The challenge of pattern collapse in semiconductor devices arises due to surface tension during the drying process, leading to stress between adjacent patterns and potential breakage or separation, which decreases product yield and reliability.
Innovation Solution
A surface treatment agent comprising a silylating agent and a compound with an amide skeleton is used to impart water repellency to semiconductor substrates, forming a self-assembled monolayer that reduces surface tension and enhances hydrophobicity, thereby preventing pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silylating agent is used to impart water repellency to prevent pattern collapse, then the reliability of semiconductor devices is improved, but the quality stability of the surface treatment agent deteriorates due to precipitation
Solution Approach 1:
An amide compound is introduced as an intermediary substance to mediate between the silylating agent and water. The amide compound forms a complex with the silylating agent, preventing direct precipitation while maintaining water repellency functionality. This intermediary approach resolves the contradiction by stabilizing the surface treatment agent composition without compromising its effectiveness in preventing pattern collapse.
Solution Approach 2:
The invention creates a composite system consisting of a silylating agent and an amide compound working together. The amide compound acts as a stabilizing component that prevents precipitation of the silylating agent in aqueous environments. This composite material approach maintains both the water repellency function and the quality stability of the surface treatment agent throughout storage and usage.
2Productivity
If surface treatment is applied to prevent pattern collapse, then the yield of semiconductor products is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The surface treatment agent serves multiple functions simultaneously: it provides water repellency to prevent pattern collapse, maintains stability during storage without precipitation, and simplifies the manufacturing process by being a ready-to-use stable solution. This multi-functionality approach improves productivity while avoiding additional process complexity that would arise from separate stabilization steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The surface treatment agent stabilizes the quality of the semiconductor substrate, improving water repellency and preventing pattern collapse, thus enhancing the reliability and yield of semiconductor devices.
Implementation Method 1
forming a self-assembled monolayer that reduces surface tension and enhances hydrophobicity
Implementation Method 2
a silylating agent (A) and a compound (C) having an amide skeleton in a molecule
Data Source
AI summary
A surface treatment agent containing a silylating agent (A) and a compound (C) having an amide skeleton in a molecule, and a surface treatment method for subjecting an object to be treated to surface treatment using the surface treatment agent.