Simplified SiP Structure Without Interposer
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Solution Overview
Problem
Traditional system in package (SiP) designs are bulky due to the use of discrete solder balls, interposers, package substrates, system boards, and underfills, which hinder the development of smaller, lighter, and thinner consumer electronics.
Innovation Solution
A simplified SiP structure is developed without using solder balls, interposers, package substrates, or underfills, integrating redistribution layers (RDLs) according to IC and PCB design rules, with molding material encapsulating chips and redistribution circuitry, and gold fingers for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional SiP components (solder balls, interposers, package substrates, system boards, underfills) are used, then electrical connections and component mounting are achieved, but the system becomes bulky and complex
Solution Approach 1:
The patent merges multiple discrete components (interposer, package substrate, system board) into a single integrated package substrate. The redistribution layers perform both the interposer's electrical routing function and the package substrate's structural function, eliminating the need for separate interposer and package substrate components. This consolidation directly reduces the number of discrete parts and overall package volume.
Solution Approach 2:
The package substrate is designed to perform multiple functions simultaneously: it serves as the mechanical support structure, provides electrical redistribution through integrated RDLs, replaces the interposer's TSV routing function, and eliminates the need for separate solder balls through direct chip mounting. This multi-functionality reduces device complexity while maintaining all necessary electrical connections.
2Weight of moving object
If multiple discrete components are used for electrical connections, then reliable electrical pathways are established, but the system weight increases
Solution Approach 1:
The patent combines the electrical connection function of solder balls with the structural support function of the package substrate into a single integrated design. The redistribution layers are directly formed on the package substrate, eliminating the need for separate solder ball interconnects. This integration reduces the total material weight while maintaining electrical connection reliability through the integrated RDL structure.
3Ease of manufacture
If traditional multi-layer structure with interposer and package substrate is used, then electrical redistribution is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the separate interposer component from the traditional multi-layer structure. The redistribution layers are directly integrated onto the package substrate, removing the intermediate interposer layer that requires separate manufacturing and assembly processes. This simplification directly improves ease of manufacture by reducing the number of fabrication steps and assembly operations required.
4Volume of moving object
If underfill material is used between components, then mechanical strength and reliability are improved, but the package volume increases
Solution Approach 1:
The patent merges the mechanical support function traditionally provided by underfill material with the structural function of the package substrate. The integrated RDL structure provides both electrical connection and mechanical support, eliminating the need for separate underfill material. This integration reduces package volume while maintaining interface strength through the rigid substrate structure.
Data Source
AI summary
An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip package to mount. A chip is wrapped by molding material, a first redistribution circuitry is built on a bottom side of the molding material; a second redistribution circuitry is built on a bottom side of the first redistribution circuitry. A third redistribution circuitry is built on a bottom side of the second redistribution circuitry. Plated metal vias are configured between each two of the electrical components.