Substrate Working Machine Using Simultaneous Pin-Hole Imaging
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Solution Overview
Problem
Existing substrate working machines face challenges in accurately inserting multiple terminals of a component into multiple through-holes in a substrate, with issues arising from deviations in pin and hole positioning and shape.
Innovation Solution
A substrate working machine equipped with a holding device, inserting device, and imaging device that calculates the positions and shapes of pins and through-holes based on captured image data, ensuring precise alignment and insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional positioning methods are used for inserting terminals into through-holes, then the device structure is simple, but the insertion accuracy deteriorates due to deviations in pin and hole positioning
Solution Approach 1:
The imaging device captures images of the substrate and component before the insertion process to detect the actual positions and shapes of through-holes and terminals. This preliminary detection allows the system to calculate deviation amounts and determine correction values in advance, enabling accurate insertion despite manufacturing variations.
Solution Approach 2:
The system uses imaging data to detect actual positions and shapes, calculates deviation amounts between designed and actual positions, and determines correction values based on these deviations. This feedback mechanism continuously adjusts the insertion process to maintain high accuracy.
2Measurement precision
If multiple through-holes are imaged separately to calculate positions, then the measurement precision is high, but the loss of time increases due to sequential imaging
Solution Approach 1:
The imaging device captures images of multiple through-holes and their corresponding terminals simultaneously in a single operation, rather than imaging each through-hole separately. This merging of imaging operations significantly reduces the total imaging time while maintaining the precision needed for position calculation.
Data Source
AI summary
Provided is a substrate working machine including a holding device configured to hold a substrate in which multiple through-holes are formed, an inserting device configured to insert multiple terminals of a component into the multiple through-holes of the substrate held by the holding device, and an imaging device configured to simultaneously image a shape of a pair of pins and a pair of through-holes of the multiple through-holes, in which positions of the pair of through-holes and the shape of the pair of pins are calculated based on image data captured by the imaging device.