Simultaneous Sintering and Soldering Semiconductor Power Module Assembly
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Solution Overview
Problem
Current methods for assembling semiconductor power modules face challenges in achieving simultaneous high-strength and reliable soldering and sintering joins, particularly at high temperatures and under temperature cycling, due to difficulties in matching process parameters like temperature and pressure, and the need for separate process steps for sintering and soldering, which increases manufacturing time and can result in low-quality joins.
Innovation Solution
A method and system that simultaneously perform sintering and soldering in a single process step by applying heat and pressure, using stabilizing means like copper mesh or spherical spacers to maintain solder material within the join area, allowing for harmonized temperature and pressure conditions to ensure strong and reliable joins across all joining planes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate process steps are used for sintering and soldering, then each joining plane can be optimized for its specific requirements, but manufacturing time increases and process complexity increases
Solution Approach 1:
The patent combines sintering and soldering processes into a single simultaneous operation. The pressing apparatus applies pressure to the entire stack including both sintering areas (with semiconductor chips) and soldering areas (with substrates and base plates) at the same time, eliminating the need for separate process steps and reducing manufacturing time while maintaining joining quality through optimized process parameters
2Strength
If pressure is applied during simultaneous sintering and soldering, then sintering joins achieve high strength, but solder material may be squeezed out of the soldering area
Solution Approach 1:
The patent applies different local conditions to different areas of the stack. The pressing apparatus is designed to apply pressure selectively: higher pressure to sintering areas to achieve strong joins, and controlled lower pressure to soldering areas to prevent solder material extrusion. This localized pressure control allows simultaneous optimization of both sintering strength and solder joint quality in a single process step
3Reliability
If high temperature is applied for sintering, then sintering joins achieve high reliability, but solder material may degrade or lose integrity
Solution Approach 1:
The patent optimizes process parameters for simultaneous operation. The sintering process is conducted at temperatures and time profiles that achieve reliable sintering joins while the soldering process uses harmonized parameters that prevent solder degradation. By carefully controlling temperature curves, pressure profiles, and atmospheric conditions, both processes proceed simultaneously without compromising either join quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and reliable assembly of semiconductor power modules with simultaneous sintering and soldering, reducing manufacturing time and improving the integrity of joins, while maintaining the thermal and mechanical stability required for high-temperature operations.
Implementation Method 1
the first element and the second element are joined by sintering in a sintering area
Implementation Method 2
the soldering area is heated to a temperature of soldering and the sintering area is heated to a temperature of sintering
Implementation Method 3
stabilizing means like copper mesh or spherical spacers to maintain solder material within the join area
Data Source
AI summary
A method of assembling a semiconductor power module component 30 and a manufacturing system comprising such a semiconductor power module component and a pressing apparatus 20 for manufacturing a semiconductor power module component are described. The semiconductor power module component 30 comprises at least a first element 1, a second element 2 and a third element 3 arranged in a stack 10. The first element 1 and the second element 2 are joined by sintering in a sintering area 4 and the second element 2 and the third element 3 are joined by soldering in a soldering area 6. The sintering and the soldering are simultaneously executed, wherein the soldering area 6 is heated to a temperature of soldering and the sintering area 4 is heated to a temperature of sintering, the temperature of soldering and the temperature of sintering being harmonized to each other. Pressure is being applied to the stack 10, comprising the at least one soldering area 6 and the at least one sintering area 4 with stabilizing means 7 being arranged in the soldering area 6.